Inventor · disambiguated record
Julio Brandelero
Also filed as: BRANDELERO JULIO · BRANDELERO JULIO CEZAR
14 granted patents·6 pending applications·15 citations·filing 2017–2025
85Inventor score
Top patents by PatentIndex Score
20 records- 0193US11169201B2Diagnostic device and method to establish degradation state of electrical connection in power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Nov 9, 2021·9 cites·15 claims
- 0275US11251151B2System and method for allowing restoration of interconnection of die of power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 15, 2022·2 cites·13 claims
- 0373US11114349B2System and method for allowing restoration of first interconnection of die of power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 7, 2021·2 cites·10 claims
- 0471US10886871B2Method for controlling health of multi-die power module and multi-die health monitoring deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 5, 2021·1 cites·11 claims
- 0569US11448557B2Method and device for determining junction temperature of die of semiconductor power moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 20, 2022·1 cites·19 claims
- 0662US12416528B2Device and method for sensing an over-temperature of a power semiconductorMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Sep 16, 2025·0 cites·13 claims
- 0762US2025330169A1Transistor control circuitST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 0855US11929346B2Device and method for increasing the reliability of a power moduleMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Mar 12, 2024·0 cites·11 claims
- 0953US12013428B2Method and device for monitoring gate signal of power semiconductorMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jun 18, 2024·0 cites·14 claims
- 1052US11955539B2Device and method for manufacturing deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Apr 9, 2024·0 cites·12 claims
- 1150US12480823B2Method and system for determining junction temperature of power semiconductorMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Nov 25, 2025·0 cites·8 claims
- 1250US2025164545A1Measurement method of flatband voltage of power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1349US2025155294A1Measurement method for estimating temperature of power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1448US2025271490A1Method for detection of mismatch between parallel power electronic element, power electronic module, computer software, computer-readable non-transient recording mediumMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1547US11038498B2Device and method for controlling switchingMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jun 15, 2021·0 cites·10 claims
- 1645US11630154B2Method and device for monitoring connection of semiconductor of power moduleMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Apr 18, 2023·0 cites·17 claims
- 1745US10848052B2Device and method for controlling temperature of multi-die power moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Nov 24, 2020·0 cites·10 claims
- 1845US2024272222A1Method and device for increasing lifetime of power die or power moduleMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1942US2025183887A1Treatment method of power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2040US11388845B2Multi-die temperature control device and method for controlling temperature of multi-die power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 12, 2022·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →