Inventor · disambiguated record
Chingju Lin
Also filed as: LIN CHINGJU
4 granted patents·6 pending applications·4 citations·filing 2022–2024
60Inventor score
Files withSTROKE PREC ADVANCED ENGINEERING CO LTD6ASTI GLOBAL INC TAIWAN2MICRAFT SYSTEM PLUS CO LTD2
Top patents by PatentIndex Score
10 records- 0187US11973054B2Method for transferring electronic deviceSTROKE PREC ADVANCED ENGINEERING CO LTD·Filed 2022·Granted Apr 30, 2024·4 cites·7 claims
- 0270US12224263B2Method for transferring electronic deviceMICRAFT SYSTEM PLUS CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·7 claims
- 0349US2024105671A1Apparatus for transferring electronic component and method for bonding electronic componentSTROKE PREC ADVANCED ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 0449US2024203934A1Apparatus for bonding electronic component, method for bonding electronic component, and method for manufacturing light-emitting diode displaySTROKE PREC ADVANCED ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 0548US2025022836A1Apparatus and method for partially flattening a substrate, bonding an electronic component, and manufacturing a displaySTROKE PREC ADVANCED ENGINEERING CO LTD·Filed 2024·Application pending·0 cites
- 0647US12261071B2Electronic component transfer apparatus, electronic component transfer method, and method of manufacturing a light-emitting diode panelASTI GLOBAL INC TAIWAN·Filed 2022·Granted Mar 25, 2025·0 cites·11 claims
- 0745US12322630B2Apparatus for transferring electronic component from flexible carrier substrate to flexible target substrate and method of transferring electronic componentMICRAFT SYSTEM PLUS CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·6 claims
- 0845US2024145427A1Apparatus configured to transfer electronic component, method for bonding electronic component, and method for manufacturing light-emitting diode displaySTROKE PREC ADVANCED ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
- 0944US2022359253A1Electronic component transferring apparatus, electronic component transferring method and manufacturing method of light-emitting diode panelASTI GLOBAL INC TAIWAN·Filed 2022·Application pending·0 cites
- 1042US2023402562A1Transferring apparatus configured to transfer electronic component, method of bonding electronic component, and method for manufacturing light-emitting diode displaySTROKE PREC ADVANCED ENGINEERING CO LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chingju Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →