Inventor · disambiguated record
Yoshihide Sekito
Also filed as: SEKITO YOSHIHIDE
18 granted patents·1 pending application·20 citations·filing 2007–2017
89Inventor score
Top patents by PatentIndex Score
19 records- 0182US8993897B2Photosensitive resin composition and use thereofSEKITO YOSHIHIDE·Filed 2012·Granted Mar 31, 2015·6 cites·18 claims
- 0277US8828525B2Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plateKIDO MASAYOSHI·Filed 2011·Granted Sep 9, 2014·2 cites·25 claims
- 0372US9835942B2Photosensitive resin composition and use thereofSEKITO YOSHIHIDE·Filed 2011·Granted Dec 5, 2017·2 cites·14 claims
- 0470US9267004B2Polyimide precursor composition and use thereofOKADA KOJI·Filed 2009·Granted Feb 23, 2016·1 cites·23 claims
- 0570US8883894B2Insulating film and printed wiring board provided with insulating filmSEKITO YOSHIHIDE·Filed 2012·Granted Nov 11, 2014·1 cites·19 claims
- 0669US9081276B2Photosensitive resin composition production kit, and use thereofKODA TOMOHIRO·Filed 2011·Granted Jul 14, 2015·2 cites·7 claims
- 0768US9072177B2Conductive layer integrated FPCKIDO MASAYOSHI·Filed 2012·Granted Jun 30, 2015·2 cites·5 claims
- 0866US8754186B2Polyimide precursor composition, use thereof and production method thereofFUJIHARA KAN·Filed 2007·Granted Jun 17, 2014·2 cites·14 claims
- 0963US10292262B2Reinforcing-plate-integrated flexible printed circuit boardKANEKA CORP·Filed 2013·Granted May 14, 2019·1 cites·6 claims
- 1062US9237645B2Flexible printed circuit integrated with conductive layerKIDO MASAYOSHI·Filed 2012·Granted Jan 12, 2016·1 cites·5 claims
- 1159US9332653B2Resin composition for insulating film, and use thereofKANEKA CORP·Filed 2012·Granted May 3, 2016·0 cites·16 claims
- 1255US10045433B2Conductive-layer-integrated flexible printed circuit boardKANEKA CORP·Filed 2017·Granted Aug 7, 2018·0 cites·5 claims
- 1354US9723708B2Conductive-layer-integrated flexible printed circuit boardKANEKA CORP·Filed 2013·Granted Aug 1, 2017·0 cites·4 claims
- 1453US9458279B2Resin composition and use thereofSEKITO YOSHIHIDE·Filed 2009·Granted Oct 4, 2016·0 cites·12 claims
- 1552US9957390B2Resin composition for pigment-containing insulating film, and use thereofKANEKA CORP·Filed 2012·Granted May 1, 2018·0 cites·19 claims
- 1651US8729402B2Polyimide precursor composition, use of the of the same, and production method of the sameSEKITO YOSHIHIDE·Filed 2009·Granted May 20, 2014·0 cites·7 claims
- 1750US10030133B2Black photosensitive resin composition and use of sameKANEKA CORP·Filed 2012·Granted Jul 24, 2018·0 cites·7 claims
- 1850US9204528B2Flexible printed circuit integrated with stiffenerKIDO MASAYOSHI·Filed 2012·Granted Dec 1, 2015·0 cites·4 claims
- 1945US2010132989A1Novel polyimide precursor composition and use thereofFUJIHARA KAN·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →