Inventor · disambiguated record
Gary P. Morrison
Also filed as: MORRISON GARY P · MORRISON GARY PAUL
10 granted patents·3 pending applications·75 citations·filing 2003–2018
88Inventor score
Top patents by PatentIndex Score
13 records- 0190US8178976B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2009·Granted May 15, 2012·18 cites·14 claims
- 0282US8154134B2Packaged electronic devices with face-up die having TSV connection to leads and die padBONIFIELD THOMAS D·Filed 2009·Granted Apr 10, 2012·15 cites·14 claims
- 0380US9666553B2Millimeter wave integrated circuit with ball grid array package including transmit and receive channelsTEXAS INSTRUMENTS INC·Filed 2015·Granted May 30, 2017·3 cites·20 claims
- 0479US8431481B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2012·Granted Apr 30, 2013·4 cites·11 claims
- 0576US7790597B2Solder cap application process on copper bump using solder powder filmTEXAS INSTRUMENTS INC·Filed 2008·Granted Sep 7, 2010·7 cites·11 claims
- 0675US6762498B1Ball grid array package for high speed devicesTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 13, 2004·19 cites·21 claims
- 0759US7462783B2Semiconductor package having a grid array of pin-attached ballsTEXAS INSTRUMENTS INC·Filed 2004·Granted Dec 9, 2008·9 cites·10 claims
- 0857US10262957B2Millimeter wave integrated circuit with ball grid array package including transmit and receive channelsTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 16, 2019·0 cites·19 claims
- 0954US9941228B2Millimeter wave integrated circuit with ball grid array package including transmit and receive channelsTEXAS INSTRUMENTS INC·Filed 2017·Granted Apr 10, 2018·0 cites·19 claims
- 1052US8436475B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2012·Granted May 7, 2013·0 cites·10 claims
- 1147US2009061566A1Semiconductor package having a grid array of pin-attached ballsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1240US2013299966A1Wsp die with offset redistribution layer capture padKUMAR ANIL KV·Filed 2012·Application pending·0 cites
- 1338US2013299967A1Wsp die having redistribution layer capture pad with at least one voidDANIELS JEFFREY DAVID·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →