Inventor · disambiguated record
Wai Keong Wong
Also filed as: WONG WAI KEONG · WONG WAI KEONG ALVIN · WONG WAI KEONG BRYCE
14 granted patents·1 pending application·36 citations·filing 2008–2022
89Inventor score
Files withWONG WAI KEONG5FREESCALE SEMICONDUCTOR INC2NAT DIVERSIFIED SALES INC2CHAN SOON KANG1CHEE SOO CHOONG1
Top patents by PatentIndex Score
15 records- 0186US11795629B2Articulating channelNAT DIVERSIFIED SALES INC·Filed 2022·Granted Oct 24, 2023·4 cites·8 claims
- 0284US12123523B2Multi pipe connectorNAT DIVERSIFIED SALES INC·Filed 2022·Granted Oct 22, 2024·1 cites·5 claims
- 0380US8643159B2Lead frame with grooved lead fingerWONG WAI KEONG·Filed 2012·Granted Feb 4, 2014·7 cites·11 claims
- 0479US7956471B2Mold and substrate for use with moldFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 7, 2011·4 cites·5 claims
- 0577US8198143B2Mold and substrate for use with moldEU POH LENG·Filed 2011·Granted Jun 12, 2012·3 cites·5 claims
- 0665US9099363B1Substrate with corner cut-outs and semiconductor device assembled therewithWONG WAI KEONG·Filed 2014·Granted Aug 4, 2015·4 cites·19 claims
- 0757US8016183B2Adjustable clamp system and method for wire bonding die assemblyFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Sep 13, 2011·3 cites·7 claims
- 0856US7581331B2Calibration device for nozzle and calibration method for nozzleUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 1, 2009·5 cites·20 claims
- 0955US8519519B2Semiconductor device having die pads isolated from interconnect portion and method of assembling sameLEE BENG SIONG·Filed 2010·Granted Aug 27, 2013·3 cites·9 claims
- 1048US9190339B2Method of limiting capillary action of gel material during assembly of pressure sensorCHAN SOON KANG·Filed 2014·Granted Nov 17, 2015·1 cites·11 claims
- 1148US9006874B2Lead frame with grooved lead fingerWONG WAI KEONG·Filed 2014·Granted Apr 14, 2015·0 cites·6 claims
- 1246US9595505B2Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereofCHEN SHOUHUI·Filed 2014·Granted Mar 14, 2017·1 cites·19 claims
- 1343US9165869B1Semiconductor device with twisted leadsCHEE SOO CHOONG·Filed 2014·Granted Oct 20, 2015·0 cites·12 claims
- 1441US9293395B2Lead frame with mold lock structureWONG WAI KEONG·Filed 2014·Granted Mar 22, 2016·0 cites·6 claims
- 1536US2012318853A1Heater block for wire bonding systemWONG WAI KEONG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →