Inventor · disambiguated record
Mei-Ling Chen
Also filed as: CHEN MEI · CHEN MEI-LING
60 granted patents·23 pending applications·147 citations·filing 2000–2024
98Inventor score
Files withPFC DEVICE HOLDINGS LTD13PFC DEVICE CORP10UNITED MICROELECTRONICS CORP9YOUNG OPTICS INC7CHEN MEI-LING6
Top patents by PatentIndex Score
83 records- 0193US9812390B2Semiconductor devices including conductive features with capping layers and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·8 cites·20 claims
- 0291US8664701B2Rectifier with vertical MOS structureCHAO KUO-LIANG·Filed 2012·Granted Mar 4, 2014·14 cites·10 claims
- 0389US7378343B2Dual damascence process utilizing teos-based silicon oxide cap layer having reduced carbon contentUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 27, 2008·20 cites·20 claims
- 0485US8405184B2Trench schottky diode and method for manufacturing the sameCHAO KOU-LIANG·Filed 2010·Granted Mar 26, 2013·10 cites·8 claims
- 0583US9640428B2Self-aligned repairing process for barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 2, 2017·3 cites·20 claims
- 0683US6555477B1Method for preventing Cu CMP corrosionTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 29, 2003·33 cites·20 claims
- 0781US9514928B2Selective repairing process for barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 6, 2016·4 cites·19 claims
- 0879US9349689B2Semiconductor devices including conductive features with capping layers and methods of forming the sameYang hui-chun·Filed 2012·Granted May 24, 2016·5 cites·19 claims
- 0977US8618626B2Trench Schottky rectifier device and method for manufacturing the sameCHAO KOU-LIANG·Filed 2010·Granted Dec 31, 2013·3 cites·6 claims
- 1077US8536283B2Varnish composition with high glass transition temperature for glass fiber laminateTZOU MING-JEN·Filed 2011·Granted Sep 17, 2013·2 cites·4 claims
- 1175US8704298B1MOS diode with termination structure and method for manufacturing the samePFC DEVICE CORP·Filed 2013·Granted Apr 22, 2014·4 cites·16 claims
- 1274US8853748B2Rectifier with vertical MOS structurePFC DEVICE CORP·Filed 2014·Granted Oct 7, 2014·2 cites·10 claims
- 1374US8084357B2Method for manufacturing a dual damascene opening comprising a trench opening and a via openingCHEN WEI-CHIH·Filed 2007·Granted Dec 27, 2011·5 cites·8 claims
- 1473US7499218B1Illumination systemYOUNG OPTICS INC·Filed 2007·Granted Mar 3, 2009·6 cites·19 claims
- 1571US10262895B2Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 16, 2019·1 cites·20 claims
- 1671US7641212B1Bicycle frame whose axle peg has a non-rotatable functionLIAO WU-HSIUNG·Filed 2007·Granted Jan 5, 2010·8 cites·17 claims
- 1770US7947565B2Forming method of porous low-k layer and interconnect processUNITED MICROELECTRONICS CORP·Filed 2007·Granted May 24, 2011·4 cites·17 claims
- 1869US8350246B2Structure of porous low-k layer and interconnect structureUNITED MICROELECTRONICS CORP·Filed 2011·Granted Jan 8, 2013·2 cites·25 claims
- 1967US8011642B2Cruising aeratorTSAI MING-CHIN·Filed 2009·Granted Sep 6, 2011·3 cites·20 claims
- 2065US8481412B2Method of and apparatus for active energy assist bakingKO CHUNG-CHI·Filed 2010·Granted Jul 9, 2013·1 cites·20 claims
- 2163US7851030B2Method of reducing number of particles on low-k material layerUNITED MICROELECTRONICS CORP·Filed 2006·Granted Dec 14, 2010·1 cites·14 claims
- 2261US9905666B2Trench schottky rectifier device and method for manufacturing the samePFC DEVICE HOLDINGS LTD·Filed 2017·Granted Feb 27, 2018·0 cites·8 claims
- 2361US2024327205A1Pressure sensing module and manufacturing method thereofCORETRONIC MEMS CORP·Filed 2024·Application pending·0 cites
- 2460US9362350B2MOS P-N junction diode with enhanced response speed and manufacturing method thereofPFC DEVICE HOLDINGS LTD·Filed 2014·Granted Jun 7, 2016·0 cites·3 claims
- 2559US9865700B2MOS P-N junction diode with enhanced response speed and manufacturing method thereofPFC DEVICE HOLDINGS LTD·Filed 2017·Granted Jan 9, 2018·0 cites·8 claims
- 2659US9853120B2Trench Schottky rectifier device and method for manufacturing the samePFC DEVICE HOLDINGS LTD·Filed 2016·Granted Dec 26, 2017·0 cites·8 claims
- 2759US9219170B2Trench schottky rectifier device and method for manufacturing the samePFC DEVICE HOLDINGS LTD·Filed 2014·Granted Dec 22, 2015·0 cites·6 claims
- 2859US8993427B2Method for manufacturing rectifier with vertical MOS structurePFC DEVICE CORP·Filed 2014·Granted Mar 31, 2015·0 cites·20 claims
- 2958US10743626B2Umbrella drawing-in by windingCHO CHIN-HSING·Filed 2018·Granted Aug 18, 2020·1 cites·8 claims
- 3058US8558315B2Trench isolation MOS P-N junction diode device and method for manufacturing the sameCHEN MEI-LING·Filed 2011·Granted Oct 15, 2013·1 cites·3 claims
- 3157US9536976B2Trench schottky rectifier device and method for manufacturing the samePFC DEVICE HOLDINGS LTD·Filed 2015·Granted Jan 3, 2017·0 cites·6 claims
- 3257US8890279B2Trench Schottky rectifier device and method for manufacturing the samePFC DEVICE CORP·Filed 2013·Granted Nov 18, 2014·0 cites·6 claims
- 3356US9004914B2Method of and apparatus for active energy assist bakingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·0 cites·20 claims
- 3456US8386161B2Route planning methods and systemsMITAC INT CORP·Filed 2009·Granted Feb 26, 2013·1 cites·12 claims
- 3555US9029235B2Trench isolation MOS P-N junction diode device and method for manufacturing the samePFC DEVICE CORP·Filed 2014·Granted May 12, 2015·0 cites·5 claims
- 3655US8921949B2MOS P-N junction diode with enhanced response speed and manufacturing method thereofPFC DEVICE CORP·Filed 2012·Granted Dec 30, 2014·0 cites·1 claims
- 3755US8378365B2Light emitting diode package and projection apparatusYOUNG OPTICS INC·Filed 2009·Granted Feb 19, 2013·0 cites·16 claims
- 3854US9324606B2Self-aligned repairing process for barrier layerTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 26, 2016·0 cites·20 claims
- 3954US8735228B2Trench isolation MOS P-N junction diode device and method for manufacturing the samePFC DEVICE CORP·Filed 2013·Granted May 27, 2014·0 cites·5 claims
- 4054US2023117559A1Sensing moduleCORETRONIC MEMS CORP·Filed 2022·Application pending·0 cites
- 4153US6176770B1Grindstone having a vacuum system in a pin chuck stepperUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jan 23, 2001·4 cites·4 claims
- 4252US9379180B2Super junction for semiconductor device and method for manufacturing the samePFC DEVICE HOLDINGS LTD·Filed 2013·Granted Jun 28, 2016·0 cites·4 claims
- 4351US2009275211A1Fabrication method of porous low-k dielectric filmCHEN MEI-LING·Filed 2009·Application pending·0 cites
- 4451US2023062685A1Varaiable focal length optical elementCORETRONIC MEMS CORP·Filed 2022·Application pending·0 cites
- 4550US9595617B2MOS P-N junction diode with enhanced response speed and manufacturing method thereofPFC DEVICE HOLDING LTD·Filed 2016·Granted Mar 14, 2017·0 cites·9 claims
- 4650US8877083B2Surface treatment in the formation of interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 4, 2014·0 cites·20 claims
- 4750US8029143B2Illumination systemYOUNG OPTICS INC·Filed 2007·Granted Oct 4, 2011·1 cites·15 claims
- 4850US2012099085A1Light emitting diode package and projection apparatusCHEN MEI-LING·Filed 2011·Application pending·0 cites
- 4948US10312080B2Method for forming amorphous silicon multuple layer structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 4, 2019·0 cites·13 claims
- 5048US8753963B2Manufacturing method of multi-trench termination structure for semiconductor devicePFC DEVICE CORP·Filed 2013·Granted Jun 17, 2014·0 cites·10 claims
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →