Inventor · disambiguated record
Florian Bieck
Also filed as: BIECK FLORIAN
15 granted patents·3 pending applications·288 citations·filing 2002–2015
93Inventor score
Top patents by PatentIndex Score
18 records- 0195US7285834B2Process for producing microelectromechanical components and a housed microelectromechanical componentSCHOTT AG·Filed 2006·Granted Oct 23, 2007·39 cites·40 claims
- 0294US6911392B2Process for making contact with and housing integrated circuitsSCHOTT GLAS·Filed 2002·Granted Jun 28, 2005·76 cites·61 claims
- 0389US6894358B2Process for producing microelectromechanical components and a housed microelectromechanical componentSCHOTT GLAS·Filed 2002·Granted May 17, 2005·61 cites·46 claims
- 0486US7160478B2Method for producing electronic componetsSCHOTT AG·Filed 2002·Granted Jan 9, 2007·43 cites·43 claims
- 0585US9929018B2Semiconductor wafer and method for producing sameDISCO CORP·Filed 2015·Granted Mar 27, 2018·10 cites·7 claims
- 0681US7071521B2Process for producing microelectromechanical components and a housed microelectromechanical componentSCHOTT AG·Filed 2004·Granted Jul 4, 2006·36 cites·42 claims
- 0771US7700957B2Process for making contact with and housing integrated circuitsSCHOTT AG·Filed 2004·Granted Apr 20, 2010·11 cites·6 claims
- 0868US7821106B2Process for making contact with and housing integrated circuitsSCHOTT AG·Filed 2008·Granted Oct 26, 2010·2 cites·9 claims
- 0967US9245765B2Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor waferBIECK FLORIAN·Filed 2010·Granted Jan 26, 2016·2 cites·11 claims
- 1059US9207276B2Method and apparatus for testing a semiconductor waferBIECK FLORIAN·Filed 2009·Granted Dec 8, 2015·3 cites·20 claims
- 1159US7825029B2Method for the production of structured layers on substratesSCHOTT AG·Filed 2003·Granted Nov 2, 2010·4 cites·38 claims
- 1258US8114304B2Method for producing electronic componentsLEIB JUERGEN·Filed 2006·Granted Feb 14, 2012·1 cites·3 claims
- 1353US2013137259A1Process for Making Contact with and Housing Integrated CircuitsBIECK FLORIAN·Filed 2013·Application pending·0 cites
- 1450US9076779B1Packaging of electronic circuitryBIECK FLORIAN·Filed 2012·Granted Jul 7, 2015·0 cites·18 claims
- 1549US9000512B1Packaging of electronic circuitryBIECK FLORIAN·Filed 2013·Granted Apr 7, 2015·0 cites·23 claims
- 1647US2011260296A1Semiconductor wafer and method for producing sameBIECK FLORIAN·Filed 2009·Application pending·0 cites
- 1745US9063407B2Photolithography mask method for a wafer, method for producing same, and photolithography method for wafer using the sameBIECK FLORIAN·Filed 2011·Granted Jun 23, 2015·0 cites·15 claims
- 1836US2006051584A1Process for producing a product having a structured surfaceBIECK FLORIAN·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →