Inventor · disambiguated record
Stephen W. Macquarrie
Also filed as: MACQUARRIE STEPHEN W · MACQUARRIE STEPHEN WESLEY
13 granted patents·320 citations·filing 1996–2007
94Inventor score
Files withIBM13
Top patents by PatentIndex Score
13 records- 0185US6373703B2Integral design features for heatsink attach for electronic packagesIBM·Filed 2001·Granted Apr 16, 2002·38 cites·19 claims
- 0285US6212076B1Enhanced heat-dissipating printed circuit board packageIBM·Filed 1999·Granted Apr 3, 2001·61 cites·29 claims
- 0382US7737550B2Optimization of electronic package geometry for thermal dissipationIBM·Filed 2007·Granted Jun 15, 2010·10 cites·10 claims
- 0480US6522014B1Fabrication of a metalized blind viaIBM·Filed 2000·Granted Feb 18, 2003·23 cites·20 claims
- 0579US6650016B1Selective C4 connection in IC packagingIBM·Filed 2002·Granted Nov 18, 2003·23 cites·13 claims
- 0678US5969947AIntegral design features for heatsink attach for electronic packagesIBM·Filed 1997·Granted Oct 19, 1999·48 cites·18 claims
- 0774US6150716AMetal substrate having an IC chip and carrier mountingIBM·Filed 1997·Granted Nov 21, 2000·30 cites·17 claims
- 0869US5952716APin attach structure for an electronic packageIBM·Filed 1997·Granted Sep 14, 1999·33 cites·11 claims
- 0956US6576549B2Fabrication of a metalized blind viaIBM·Filed 2002·Granted Jun 10, 2003·5 cites·23 claims
- 1056US5872397ASemiconductor device package including a thick integrated circuit chip stackIBM·Filed 1996·Granted Feb 16, 1999·20 cites·3 claims
- 1149US6438830B1Process of producing plastic pin grid arrayIBM·Filed 1999·Granted Aug 27, 2002·14 cites·4 claims
- 1241US6131278AMetal substrate having an IC chip and carrier mountingIBM·Filed 1999·Granted Oct 17, 2000·7 cites·10 claims
- 1339US6107121AMethod of making interconnections between a multi-layer chip stack to a printed circuit board in a ceramic packageIBM·Filed 1998·Granted Aug 22, 2000·8 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →