Inventor · disambiguated record
Ichiro Anjoh
Also filed as: ANJOH ICHIRO
69 granted patents·3 pending applications·2,299 citations·filing 1991–2011
99Inventor score
Files withHITACHI LTD53RENESAS TECH CORP11ELPIDA MEMORY INC2AKITA ELECTRONICS SYSTEMS CO L1ELPIDIA MEMORY INC1
Top patents by PatentIndex Score
72 records- 0195US7420284B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·39 cites·9 claims
- 0294US6521981B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Feb 18, 2003·37 cites·18 claims
- 0394US6342728B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jan 29, 2002·38 cites·12 claims
- 0494US5332922AMulti-chip semiconductor packageHITACHI LTD·Filed 1991·Granted Jul 26, 1994·158 cites·16 claims
- 0593US5569960AElectronic component, electronic component assembly and electronic component unitHITACHI LTD·Filed 1995·Granted Oct 29, 1996·105 cites·38 claims
- 0692US6670215B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Dec 30, 2003·28 cites·4 claims
- 0792US6472727B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Oct 29, 2002·31 cites·20 claims
- 0891US7091620B2Semiconductor device and manufacturing method thereofAKITA ELECTRONICS SYSTEMS CO L·Filed 2005·Granted Aug 15, 2006·21 cites·20 claims
- 0991US6342726B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted Jan 29, 2002·42 cites·9 claims
- 1091US5571428ASemiconductor leadframe and its production method and plastic encapsulated semiconductor deviceHITACHI LTD·Filed 1995·Granted Nov 5, 1996·113 cites·3 claims
- 1190US5714405ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Feb 3, 1998·98 cites·40 claims
- 1289US6114005ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1997·Granted Sep 5, 2000·98 cites·19 claims
- 1388US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 1488US5677045ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1995·Granted Oct 14, 1997·86 cites·8 claims
- 1586US6710446B2Semiconductor device comprising stress relaxation layers and method for manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Mar 23, 2004·44 cites·10 claims
- 1686US6642083B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 4, 2003·17 cites·10 claims
- 1786US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 1885US6365439B2Method of manufacturing a ball grid array type semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 2, 2002·17 cites·19 claims
- 1985US5914531ASemiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1997·Granted Jun 22, 1999·68 cites·21 claims
- 2085US5583375ASemiconductor device with lead structure within the planar area of the deviceHITACHI LTD·Filed 1992·Granted Dec 10, 1996·73 cites·39 claims
- 2184US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 2284US5299092APlastic sealed type semiconductor apparatusHITACHI LTD·Filed 1992·Granted Mar 29, 1994·80 cites·15 claims
- 2383US6355500B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·14 cites·15 claims
- 2483US5466888APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1995·Granted Nov 14, 1995·72 cites·6 claims
- 2583US5442233APackaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipationHITACHI LTD·Filed 1992·Granted Aug 15, 1995·55 cites·28 claims
- 2682US5701031ASealed stacked arrangement of semiconductor devicesHITACHI LTD·Filed 1994·Granted Dec 23, 1997·58 cites·16 claims
- 2780US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 2879US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 2979US5895965ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Apr 20, 1999·58 cites·3 claims
- 3078US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 3178US5371044AMethod of uniformly encapsulating a semiconductor device in resinHITACHI LTD·Filed 1992·Granted Dec 6, 1994·60 cites·20 claims
- 3278US5357139APlastic encapsulated semiconductor device and lead frameHITACHI LTD·Filed 1993·Granted Oct 18, 1994·58 cites·10 claims
- 3376US5437915ASemiconductor leadframe and its production method and plastic encapsulated semiconductor deviceHITACHI LTD·Filed 1994·Granted Aug 1, 1995·47 cites·4 claims
- 3475US6114192AMethod of manufacturing a semiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1998·Granted Sep 5, 2000·39 cites·38 claims
- 3572US5585665APackaged semiconductor device and a leadframe thereforHITACHI LTD·Filed 1995·Granted Dec 17, 1996·31 cites·9 claims
- 3671US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 3771US6664135B2Method of manufacturing a ball grid array type semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Dec 16, 2003·7 cites·16 claims
- 3870US6396145B1Semiconductor device and method for manufacturing the same technical fieldHITACHI LTD·Filed 1998·Granted May 28, 2002·38 cites·26 claims
- 3969US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 4069US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 4168US6353255B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 5, 2002·6 cites·7 claims
- 4267US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 4365US6433440B1Semiconductor device having a porous buffer layer for semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·24 cites·19 claims
- 4464US5296737ASemiconductor device with a plurality of face to face chipsHITACHI LTD·Filed 1991·Granted Mar 22, 1994·34 cites·20 claims
- 4562US7964962B2Method of manufacturing a semiconductor apparatusELPIDIA MEMORY INC·Filed 2008·Granted Jun 21, 2011·2 cites·21 claims
- 4662US7786564B2Semiconductor device and method for manufacturing semiconductor deviceELPIDA MEMORY INC·Filed 2008·Granted Aug 31, 2010·2 cites·19 claims
- 4762US6686226B1Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frameRENESAS TECH CORP·Filed 2000·Granted Feb 3, 2004·9 cites·22 claims
- 4862US6355975B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·4 cites·15 claims
- 4962US6049128ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Apr 11, 2000·21 cites·10 claims
- 5061US7202570B2Circuit tape having adhesive film semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 10, 2007·6 cites·23 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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