Inventor · disambiguated record
J. Y. Wu
Also filed as: WU J Y
9 granted patents·514 citations·filing 1993–2000
90Inventor score
Files withUNITED MICROELECTRONICS CORP9
Top patents by PatentIndex Score
9 records- 0196US5968610AMulti-step high density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 1997·Granted Oct 19, 1999·371 cites·22 claims
- 0281US5944593ARetainer ring for polishing head of chemical-mechanical polish machinesUNITED MICROELECTRONICS CORP·Filed 1997·Granted Aug 31, 1999·64 cites·6 claims
- 0362US6100205AIntermetal dielectric layer formation with low dielectric constant using high density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 1997·Granted Aug 8, 2000·27 cites·35 claims
- 0450US7514014B1High density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 2000·Granted Apr 7, 2009·2 cites·40 claims
- 0549US5358733AStress release metallization for VLSI circuitsUNITED MICROELECTRONICS CORP·Filed 1993·Granted Oct 25, 1994·17 cites·18 claims
- 0646US5393709AMethod of making stress released VLSI structure by the formation of porous intermetal layerUNITED MICROELECTRONICS CORP·Filed 1993·Granted Feb 28, 1995·14 cites·33 claims
- 0739US5517062AStress released VLSI structure by the formation of porous intermetal layerUNITED MICROELECTRONICS CORP·Filed 1995·Granted May 14, 1996·6 cites·16 claims
- 0838US5254495ASalicide recessed local oxidation of siliconUNITED MICROELECTRONICS CORP·Filed 1993·Granted Oct 19, 1993·9 cites·25 claims
- 0931US5292680AMethod of forming a convex charge coupled deviceUNITED MICROELECTRONICS CORP·Filed 1993·Granted Mar 8, 1994·4 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →