Inventor · disambiguated record
Ruopeng Deng
Also filed as: DENG RUOPENG
5 granted patents·3 pending applications·3 citations·filing 2019–2024
66Inventor score
Files withLAM RES CORP8
Top patents by PatentIndex Score
8 records- 0177US12014928B2Multi-layer feature fillLAM RES CORP·Filed 2019·Granted Jun 18, 2024·2 cites·17 claims
- 0274US2025132201A1Nucleation-free depositionLAM RES CORP·Filed 2024·Application pending·0 cites
- 0373US11972952B2Atomic layer deposition on 3D NAND structuresLAM RES CORP·Filed 2019·Granted Apr 30, 2024·1 cites·16 claims
- 0472US2024282580A1Multi-layer feature fillLAM RES CORP·Filed 2024·Application pending·0 cites
- 0571US2024266177A1Atomic layer deposition on 3d nand structuresLAM RES CORP·Filed 2024·Application pending·0 cites
- 0663US12237221B2Nucleation-free tungsten depositionLAM RES CORP·Filed 2020·Granted Feb 25, 2025·0 cites·20 claims
- 0748US12077858B2Tungsten depositionLAM RES CORP·Filed 2020·Granted Sep 3, 2024·0 cites·21 claims
- 0846US12060639B2Rapid flush purging during atomic layer depositionLAM RES CORP·Filed 2020·Granted Aug 13, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →