Inventor · disambiguated record
Cheng-Hao Lai
Also filed as: LAI CHENG-HAO
16 granted patents·8 pending applications·12 citations·filing 2013–2025
88Inventor score
Top patents by PatentIndex Score
24 records- 0194US11553581B2Radiation source apparatus and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 10, 2023·2 cites·20 claims
- 0293US11809083B2EUV photolithography system fuel source and methods of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·2 cites·20 claims
- 0393US11533799B1System and method for supplying target material in an EUV light sourceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·2 cites·20 claims
- 0490US10670970B1Lithography system and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 2, 2020·3 cites·20 claims
- 0589US2025362616A1Inspection tool for a semiconductor processing tool and methods of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0687US12066761B2Inspection tool for an extreme ultraviolet radiation source to observe tin residualTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·1 cites·20 claims
- 0786US11528797B2Method and system for generating droplets for EUV photolithography processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·1 cites·20 claims
- 0881US2024361701A1Novel design of an inspection tool for an extreme ultraviolet radiation source to observe tin residualTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0976US10331035B2Light source for lithography exposure processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·1 cites·20 claims
- 1075US2024365460A1Droplet generator assembly and method of replacing componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1175US2024365461A1Droplet generator assembly and method of replacing componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1274US12235586B2EUV photolithography system fuel source and methods of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1373US12096543B2Method for using radiation source apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1472US12167526B2Method and system for generating droplets for EUV photolithography processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 1572US2022404716A1Inspection tool for a semiconductor processing tool and methods of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1668US12063734B2Droplet generator assembly and method of replacing componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 1765US11537053B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·20 claims
- 1862US11086225B2Lithography system and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 10, 2021·0 cites·20 claims
- 1957US11134558B2Droplet generator assembly and method for using the same and radiation source apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 2055US11576250B1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 2155US2022408538A1Semiconductor system inspection tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2254US11442365B1EUV photolithography system and methods of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 13, 2022·0 cites·20 claims
- 2348US2014166081A1Solar cell and solar cell moduleMOTECH IND INC·Filed 2013·Application pending·0 cites
- 2444US2023345610A1Method and apparatus for monitoring an extreme ultraviolet radiation sourceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →