Inventor · disambiguated record
Koichi Kumai
Also filed as: KUMAI KOICHI
7 granted patents·1 pending application·129 citations·filing 2000–2019
81Inventor score
Top patents by PatentIndex Score
8 records- 0192US6438281B1Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the sameTOPPAN PRINTING CO LTD·Filed 2000·Granted Aug 20, 2002·119 cites·78 claims
- 0280US9478674B2Method of manufacturing a circuit board by punchingDSM IP ASSETS BV·Filed 2013·Granted Oct 25, 2016·4 cites·4 claims
- 0376US10672928B2Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered bodyDSM IP ASSETS BV·Filed 2017·Granted Jun 2, 2020·2 cites·10 claims
- 0474US9831567B2Crimp terminal having a conductor crimping part with an intermediate material with recessed parts and a thin-film layer on its topYAZAKI CORP·Filed 2016·Granted Nov 28, 2017·4 cites·12 claims
- 0562US10651320B2Method of manufacturing a circuit board by punchingDSM IP ASSETS BV·Filed 2019·Granted May 12, 2020·0 cites·20 claims
- 0657US10056517B2Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered bodyDSM IP ASSETS BV·Filed 2013·Granted Aug 21, 2018·0 cites·12 claims
- 0747US10986293B2Solid-state imaging device including microlenses on a substrate and method of manufacturing the sameTOPPAN PRINTING CO LTD·Filed 2018·Granted Apr 20, 2021·0 cites·13 claims
- 0845US2017018660A1Method of manufacturing a circuit board by punchingDSM IP ASSETS BV·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →