Inventor · disambiguated record
Chuan Hu
Also filed as: GEORGE LEGAL REPRESENTATIVE AN · HU CHUAN · HU CHUAN-LING
71 granted patents·34 pending applications·577 citations·filing 2003–2025
99Inventor score
Files withINTEL CORP38INST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES17HU CHUAN15SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD8CHANT SINCERE CO LTD3
Top patents by PatentIndex Score
105 records- 0198US7420273B2Thinned die integrated circuit packageINTEL CORP·Filed 2005·Granted Sep 2, 2008·63 cites·16 claims
- 0297US9281292B2Single layer low cost wafer level packaging for SFF SiPHU CHUAN·Filed 2012·Granted Mar 8, 2016·54 cites·20 claims
- 0396US7259965B2Integrated circuit coolant microchannel assembly with targeted channel configurationINTEL CORP·Filed 2005·Granted Aug 21, 2007·40 cites·14 claims
- 0492US10122089B2Magnetic nanocomposite materials and passive components formed therewithINTEL CORP·Filed 2016·Granted Nov 6, 2018·7 cites·7 claims
- 0592US9461355B2Method apparatus and material for radio frequency passives and antennasNAIR VIJAY K·Filed 2013·Granted Oct 4, 2016·14 cites·29 claims
- 0691US7888183B2Thinned die integrated circuit packageINTEL CORP·Filed 2008·Granted Feb 15, 2011·17 cites·14 claims
- 0791US7882624B2Method of forming electronic package having fluid-conducting channelINTEL CORP·Filed 2006·Granted Feb 8, 2011·19 cites·20 claims
- 0890US7646093B2Thermal management of dies on a secondary side of a packageINTEL CORP·Filed 2006·Granted Jan 12, 2010·28 cites·26 claims
- 0988US10867961B2Single layer low cost wafer level packaging for SFF SiPINTEL CORP·Filed 2018·Granted Dec 15, 2020·4 cites·20 claims
- 1088US7009289B2Fluxless die-to-heat spreader bonding using thermal interface materialINTEL CORP·Filed 2004·Granted Mar 7, 2006·39 cites·17 claims
- 1187US9685390B2Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layerHU CHUAN·Filed 2012·Granted Jun 20, 2017·9 cites·7 claims
- 1287US9072187B2Off-plane conductive line interconnects in microelectronic devicesHU CHUAN·Filed 2012·Granted Jun 30, 2015·9 cites·16 claims
- 1386US9543197B2Package with dielectric or anisotropic conductive (ACF) buildup layerINTEL CORP·Filed 2012·Granted Jan 10, 2017·7 cites·23 claims
- 1486US7038316B2Bumpless die and heat spreader lid module bonded to bumped die carrierINTEL CORP·Filed 2004·Granted May 2, 2006·34 cites·14 claims
- 1584US7126822B2Electronic packages, assemblies, and systems with fluid coolingINTEL CORP·Filed 2003·Granted Oct 24, 2006·32 cites·29 claims
- 1683US9530747B2Solder in cavity interconnection structuresINTEL CORP·Filed 2015·Granted Dec 27, 2016·3 cites·6 claims
- 1783US7012011B2Wafer-level diamond spreaderINTEL CORP·Filed 2004·Granted Mar 14, 2006·23 cites·11 claims
- 1882US7476568B2Wafer-level assembly of heat spreaders for dual IHS packagesINTEL CORP·Filed 2006·Granted Jan 13, 2009·6 cites·8 claims
- 1982US6833289B2Fluxless die-to-heat spreader bonding using thermal interface materialINTEL CORP·Filed 2003·Granted Dec 21, 2004·27 cites·16 claims
- 2081US11333327B2Spotlight lamp with snap-fit anti-glare ringOPPLE LIGHTING CO LTD·Filed 2020·Granted May 17, 2022·2 cites·12 claims
- 2181US10615151B2Integrated circuit multichip stacked packaging structure and methodSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2016·Granted Apr 7, 2020·4 cites·20 claims
- 2281US9942980B2Wavy interconnect for bendable and stretchable devicesINTEL CORP·Filed 2014·Granted Apr 10, 2018·5 cites·21 claims
- 2381US8424748B2Solder in cavity interconnection technologyHU CHUAN·Filed 2009·Granted Apr 23, 2013·8 cites·19 claims
- 2479US10381288B2Packaged semiconductor die and CTE-engineering die pairINTEL CORP·Filed 2018·Granted Aug 13, 2019·2 cites·20 claims
- 2579US9673131B2Integrated circuit package assemblies including a glass solder mask layerINTEL CORP·Filed 2013·Granted Jun 6, 2017·5 cites·17 claims
- 2678US10014277B2Single layer low cost wafer level packaging for SFF SiPINTEL CORP·Filed 2016·Granted Jul 3, 2018·2 cites·19 claims
- 2778US8541876B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2005·Granted Sep 24, 2013·7 cites·19 claims
- 2877US9761514B2Substrate for integrated circuit devices including multi-layer glass core and methods of making the sameINTEL CORP·Filed 2016·Granted Sep 12, 2017·2 cites·17 claims
- 2977US2025092187A1Branch-containing poly(aryl piperidinium) copolymer ionomer, anion exchange membrane, and preparation method thereforIUCF HYU·Filed 2024·Application pending·0 cites
- 3076US11609672B1Touch control substrate and preparation method thereof, touch control module and display deviceINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2022·Granted Mar 21, 2023·1 cites·20 claims
- 3176US7095111B2Package with integrated wick layer and method for heat removalINTEL CORP·Filed 2003·Granted Aug 22, 2006·25 cites·19 claims
- 3275US9508675B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2013·Granted Nov 29, 2016·3 cites·27 claims
- 3375US9420707B2Substrate for integrated circuit devices including multi-layer glass core and methods of making the sameMA QING·Filed 2009·Granted Aug 16, 2016·5 cites·9 claims
- 3475US2024376266A1Poly(spirobisindane-aryl piperidinium) copolymer ionomer, anion exchange membrane, and method for preparing sameIUCF HYU·Filed 2024·Application pending·0 cites
- 3574US7319048B2Electronic assemblies having a low processing temperatureINTEL CORP·Filed 2004·Granted Jan 15, 2008·17 cites·26 claims
- 3673US9006890B2Solder in cavity interconnection structuresHU CHUAN·Filed 2013·Granted Apr 14, 2015·2 cites·7 claims
- 3773US8663485B2Method of manufacturing plastic metallized three-dimensional circuitHU CHUAN LING·Filed 2011·Granted Mar 4, 2014·3 cites·13 claims
- 3872US9741645B2Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packagesHU CHUAN·Filed 2011·Granted Aug 22, 2017·3 cites·18 claims
- 3969US7495630B2Feed point adjustable planar antennaCHANT SINCERE CO LTD·Filed 2007·Granted Feb 24, 2009·6 cites·10 claims
- 4068US7382323B2Micro chip antennaCHANT SINCERE CO LTD·Filed 2005·Granted Jun 3, 2008·8 cites·9 claims
- 4167US10847496B2Chip wiring method and structureSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2017·Granted Nov 24, 2020·1 cites·19 claims
- 4266US8080870B2Die-warpage compensation structures for thinned-die devices, and methods of assembling sameHU CHUAN·Filed 2009·Granted Dec 20, 2011·3 cites·28 claims
- 4363US8872355B2Semiconductor device with pre-molding chip bondingHU CHUAN·Filed 2012·Granted Oct 28, 2014·1 cites·6 claims
- 4462US7626251B2Microelectronic die assembly having thermally conductive element at a backside thereof and method of making sameINTEL CORP·Filed 2006·Granted Dec 1, 2009·2 cites·9 claims
- 4561US9848490B2Solder in cavity interconnection technologyINTEL CORP·Filed 2014·Granted Dec 19, 2017·0 cites·16 claims
- 4660US7682876B2Electronic assemblies having a low processing temperatureINTEL CORP·Filed 2007·Granted Mar 23, 2010·1 cites·17 claims
- 4758US10468367B2Solder in cavity interconnection structuresINTEL CORP·Filed 2018·Granted Nov 5, 2019·0 cites·11 claims
- 4857US2013206820A1Solder in cavity interconnection technologyHU CHUAN·Filed 2013·Application pending·0 cites
- 4956US12506252B2Fan-out package structure and fabrication method thereforINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 5056US9659885B2Semiconductor device with pre-molding chip bondingHU CHUAN·Filed 2014·Granted May 23, 2017·0 cites·11 claims
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →