Inventor · disambiguated record
Michael M. Li
Also filed as: LI MICHAEL M
13 granted patents·50 citations·filing 2014–2021
88Inventor score
Files withAPPLE INC13
Top patents by PatentIndex Score
13 records- 0195US11192823B2Electronic devices including laser-textured glass cover membersAPPLE INC·Filed 2019·Granted Dec 7, 2021·23 cites·12 claims
- 0293US9600694B1Laser marking processAPPLE INC·Filed 2015·Granted Mar 21, 2017·13 cites·20 claims
- 0387US10787753B2Anodized substrates with dark laser markingsAPPLE INC·Filed 2016·Granted Sep 29, 2020·2 cites·20 claims
- 0483US9844833B2System and method for laser cutting sapphire using multiple gas mediaAPPLE INC·Filed 2014·Granted Dec 19, 2017·5 cites·22 claims
- 0576US10464843B2Laser-colored sapphire materialAPPLE INC·Filed 2017·Granted Nov 5, 2019·1 cites·10 claims
- 0674US9787345B2Laser welding of transparent and opaque materialsAPPLE INC·Filed 2014·Granted Oct 10, 2017·4 cites·17 claims
- 0772US9578768B1Laser-colored sapphire materialAPPLE INC·Filed 2015·Granted Feb 21, 2017·1 cites·20 claims
- 0870US11325860B2Laser-colored sapphire materialAPPLE INC·Filed 2019·Granted May 10, 2022·0 cites·10 claims
- 0969US11945048B2Laser-based cutting of transparent components for an electronic deviceAPPLE INC·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 1069US10406634B2Enhancing strength in laser cutting of ceramic componentsAPPLE INC·Filed 2015·Granted Sep 10, 2019·1 cites·18 claims
- 1164USRE48765ELaser marking processAPPLE INC·Filed 2019·Granted Oct 5, 2021·0 cites·40 claims
- 1256US11299421B2Electronic device enclosure with a glass member having an internal encoded markingAPPLE INC·Filed 2019·Granted Apr 12, 2022·0 cites·20 claims
- 1349US10537963B2Coated substrate and process for cutting a coated substrateAPPLE INC·Filed 2014·Granted Jan 21, 2020·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Michael M. Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →