Inventor · disambiguated record
Kim J. Blackwell
Also filed as: BLACKWELL KIM J · BLACKWELL KIM JOSEPH
15 granted patents·1 pending application·398 citations·filing 1984–2010
94Inventor score
Top patents by PatentIndex Score
16 records- 0198US7800916B2Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Sep 21, 2010·80 cites·31 claims
- 0292US4508612AShield for improved magnetron sputter deposition into surface recessesIBM·Filed 1984·Granted Apr 2, 1985·41 cites·18 claims
- 0390US5372848AProcess for creating organic polymeric substrate with copperIBM·Filed 1992·Granted Dec 13, 1994·74 cites·21 claims
- 0487US6879492B2Hyperbga buildup laminateIBM·Filed 2001·Granted Apr 12, 2005·36 cites·35 claims
- 0582US6703704B1Stress reducing stiffener ringIBM·Filed 2002·Granted Mar 9, 2004·35 cites·22 claims
- 0679US6518516B2Multilayered laminateIBM·Filed 2002·Granted Feb 11, 2003·24 cites·17 claims
- 0763US6284329B1Method of forming adherent metal components on a polyimide substrateIBM·Filed 1999·Granted Sep 4, 2001·20 cites·15 claims
- 0861US6194076B1Method of forming adherent metal components on a polyimide substrateIBM·Filed 1997·Granted Feb 27, 2001·19 cites·2 claims
- 0958US5288541AMethod for metallizing through holes in thin film substrates, and resulting devicesIBM·Filed 1991·Granted Feb 22, 1994·26 cites·34 claims
- 1052US7213336B2Hyperbga buildup laminateIBM·Filed 2004·Granted May 8, 2007·3 cites·25 claims
- 1148US5525369AMethod for metallizing through holes in thin film substrates, and resulting devicesIBM·Filed 1993·Granted Jun 11, 1996·16 cites·4 claims
- 1241US5461203AElectronic package including lower water content polyimide filmIBM·Filed 1991·Granted Oct 24, 1995·10 cites·10 claims
- 1339US6235411B1Process for coating a substrate with metallic layerIBM·Filed 1994·Granted May 22, 2001·7 cites·11 claims
- 1438US2012112345A1High bandwidth semiconductor ball grid array packageBLACKWELL KIM J·Filed 2010·Application pending·0 cites
- 1533US6337004B1High adhesion performance roll sputtered strike layerIBM·Filed 1995·Granted Jan 8, 2002·3 cites·1 claims
- 1633US5766499AMethod of making a circuitized substrateIBM·Filed 1996·Granted Jun 16, 1998·4 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →