Inventor · disambiguated record
Srdjan Kordic
Also filed as: KORDIC SRDJAN
14 granted patents·4 pending applications·55 citations·filing 1998–2011
89Inventor score
Top patents by PatentIndex Score
18 records- 0185US7691756B2Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor deviceNXP BV·Filed 2006·Granted Apr 6, 2010·10 cites·19 claims
- 0274US7883393B2System and method for removing particles from a polishing padFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Feb 8, 2011·7 cites·20 claims
- 0365US8752228B2Apparatus for cleaning of circuit substratesFARKAS JANOS·Filed 2005·Granted Jun 17, 2014·3 cites·14 claims
- 0455US6528419B1Process of fabricating an integrated circuitST MICROELECTRONICS SA·Filed 2001·Granted Mar 4, 2003·9 cites·13 claims
- 0552US8066430B2Semiconductor substrate temperature determinationKORDIC SRDJAN·Filed 2007·Granted Nov 29, 2011·4 cites·13 claims
- 0648US6201291B1Semiconductor device and method of manufacturing such a devicePHILIPS CORP·Filed 1998·Granted Mar 13, 2001·15 cites·6 claims
- 0747US6917116B2Electrical connection device between two tracks of an integrated circuitKONINKLIKE PHILIPS ELECTRONICS·Filed 2003·Granted Jul 12, 2005·5 cites·20 claims
- 0846US7951729B2Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor deviceNXP BV·Filed 2010·Granted May 31, 2011·0 cites·19 claims
- 0945US8097535B2Fabrication of self-assembled nanowire-type interconnects on a semiconductor deviceCOOPER KEVIN·Filed 2007·Granted Jan 17, 2012·0 cites·12 claims
- 1045US7803719B2Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Sep 28, 2010·0 cites·20 claims
- 1144US7064053B2Process for fabricating an electrical circuit comprising a polishing stepKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Granted Jun 20, 2006·2 cites·32 claims
- 1244US2009206450A1Method of manufacturing a semiconductor device, semiconductor device obtained herewith, and slurry suitable for use in such a methodNXP BV·Filed 2007·Application pending·0 cites
- 1344US2009186560A1Wafer de-chuckingNXP BV·Filed 2007·Application pending·0 cites
- 1441US2012133031A1Fabrication of self-assembled nanowire-type interconnects on a semiconductor deviceCOOPER KEVIN·Filed 2011·Application pending·0 cites
- 1539US8263430B2Capping layer formation onto a dual damescene interconnectFARKAS JANOS·Filed 2005·Granted Sep 11, 2012·0 cites·36 claims
- 1639US2009301867A1Integrated system for semiconductor substrate processing using liquid phase metal depositionCITIBANK NA·Filed 2006·Application pending·0 cites
- 1728US9379020B2Silicide formation on a waferGERRITSEN ERIC·Filed 2007·Granted Jun 28, 2016·0 cites·8 claims
- 1826US8257506B2Pulsed chemical dispense systemDUBREUIL OLIVIER·Filed 2007·Granted Sep 4, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →