Inventor · disambiguated record
Oliver Genz
Also filed as: GENZ OLIVER
12 granted patents·173 citations·filing 1998–2009
91Inventor score
Top patents by PatentIndex Score
12 records- 0186US6031614AMeasurement system and method for measuring critical dimensions using ellipsometrySIEMENS AG·Filed 1998·Granted Feb 29, 2000·85 cites·49 claims
- 0279US7141507B2Method for production of a semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2005·Granted Nov 28, 2006·9 cites·14 claims
- 0375US6670235B1Process flow for two-step collar in DRAM preparationINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 30, 2003·16 cites·10 claims
- 0468US6740594B2Method for removing carbon-containing polysilane from a semiconductor without strippingINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 25, 2004·12 cites·13 claims
- 0554US7018781B2Method for fabricating a contact hole plane in a memory moduleINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 28, 2006·9 cites·29 claims
- 0653US7046363B2Optical measurement system and methodINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 16, 2006·6 cites·11 claims
- 0753US6387771B1Low temperature oxidation of conductive layers for semiconductor fabricationINFINEON TECHNOLOGIES AG·Filed 1999·Granted May 14, 2002·18 cites·28 claims
- 0852US8470173B2Column packing apparatus and method of making and using the sameMAIER-ROSENKRANZ JUERGEN·Filed 2009·Granted Jun 25, 2013·3 cites·10 claims
- 0947US6352893B1Low temperature self-aligned collar formationINFINEON TECHNOLOGIES AG·Filed 1999·Granted Mar 5, 2002·13 cites·22 claims
- 1043US7049228B2Method for introducing structures which have different dimensions into a substrateINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 23, 2006·1 cites·14 claims
- 1143US6558883B2Apparatus and method for patterning a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 6, 2003·1 cites·23 claims
- 1237US6809800B2Apparatus for patterning a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 26, 2004·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →