Inventor · disambiguated record
Shutesh Krishnan
Also filed as: KRISHNAN SHUTESH
20 granted patents·7 pending applications·56 citations·filing 2006–2025
93Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC19KRISHNAN SHUTESH5SEMICONDUCTOR COMPONENTS IND2Platinum Nanochem Sdn Bhd1
Top patents by PatentIndex Score
27 records- 0196US11830856B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Nov 28, 2023·8 cites·19 claims
- 0292US10319639B2Thin semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·15 cites·13 claims
- 0388US11721654B2Ultra-thin multichip power devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Aug 8, 2023·2 cites·18 claims
- 0483US11626677B2Bonding module pins to an electronic substrateSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 11, 2023·2 cites·20 claims
- 0582US8451621B2Semiconductor component and method of manufactureKRISHNAN SHUTESH·Filed 2010·Granted May 28, 2013·6 cites·24 claims
- 0682US8268676B2Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leadsKRISHNAN SHUTESH·Filed 2010·Granted Sep 18, 2012·6 cites·18 claims
- 0781US12170239B2Direct bonded copper substrates fabricated using silver sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0880US2025293213A1Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0980US2025118622A1Direct bonded copper substrates fabricated using silver sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1079US12347813B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 1177US8449339B2Connector assembly and method of manufactureKRISHNAN SHUTESH·Filed 2010·Granted May 28, 2013·4 cites·19 claims
- 1274US10930604B2Ultra-thin multichip power devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 23, 2021·2 cites·19 claims
- 1374US2025070493A1Bonding module pins to an electronic substrateSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1473US12160060B2Bonding module pins to an electronic substrateSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 1570US7402895B2Semiconductor package structure and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Jul 22, 2008·5 cites·20 claims
- 1669US8519521B2Electronic device including a packaging substrate having a trenchKRISHNAN SHUTESH·Filed 2012·Granted Aug 27, 2013·2 cites·20 claims
- 1768US11776870B2Direct bonded copper substrates fabricated using silver sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
- 1866US7939380B2Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structureSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted May 10, 2011·3 cites·24 claims
- 1965US11942369B2Thin semiconductor package for notched semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 26, 2024·0 cites·15 claims
- 2063US9997485B2Bonding structure and methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 12, 2018·1 cites·20 claims
- 2161US2025300030A1Electronic power substrate for enhanced sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 2257US10763173B2Thin semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 2356US2025038066A1Integration of semiconductor device assemblies with thermal dissipation mechanismsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 2454US2024030208A1Heterogeneous embedded power device package using dam and fillSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 2541US10106419B2Method of making graphene nanocomposites by multiphase fluid dynamic dispersionPlatinum Nanochem Sdn Bhd·Filed 2015·Granted Oct 23, 2018·0 cites·20 claims
- 2641US9780059B2Bonding structure and methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Oct 3, 2017·0 cites·20 claims
- 2737US2012018864A1Bonding structure and methodKRISHNAN SHUTESH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →