Inventor · disambiguated record
Erik Nino Tolentino
Also filed as: TOLENTINO ERIK NINO · TOLENTINO ERIK NINO MERCADO
12 granted patents·4 pending applications·19 citations·filing 2015–2025
87Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC16
Top patents by PatentIndex Score
16 records- 0196US11830856B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Nov 28, 2023·8 cites·19 claims
- 0287US11348878B2Reinforced semiconductor die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 0386US9659837B2Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted May 23, 2017·5 cites·9 claims
- 0483US11626677B2Bonding module pins to an electronic substrateSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 11, 2023·2 cites·20 claims
- 0581US12170239B2Direct bonded copper substrates fabricated using silver sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0680US2025293213A1Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0780US2025118622A1Direct bonded copper substrates fabricated using silver sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0879US12347813B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0974US2025070493A1Bonding module pins to an electronic substrateSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1073US12160060B2Bonding module pins to an electronic substrateSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 1173US11791288B2Reinforced semiconductor die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 1273US9991185B2Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 5, 2018·2 cites·19 claims
- 1368US11776870B2Direct bonded copper substrates fabricated using silver sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
- 1462US2020161209A1Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 1557US10700018B2Reinforced semiconductor die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jun 30, 2020·0 cites·15 claims
- 1652US10546798B2Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jan 28, 2020·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →