Inventor · disambiguated record
Sheng-Tsai Wu
Also filed as: WU SHENG-TSAI
17 granted patents·1 pending application·31 citations·filing 2012–2023
89Inventor score
Top patents by PatentIndex Score
18 records- 0187US11424190B2Multi-chip package and manufacture method thereofIND TECH RES INST·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
- 0286US11251174B2Image sensor package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted Feb 15, 2022·2 cites·16 claims
- 0384US9252054B2Thinned integrated circuit device and manufacturing process for the sameIND TECH RES INST·Filed 2014·Granted Feb 2, 2016·7 cites·18 claims
- 0481US11854961B2Package substrate and method of fabricating the same and chip package structureIND TECH RES INST·Filed 2020·Granted Dec 26, 2023·1 cites·27 claims
- 0581US11004816B2Hetero-integrated structureIND TECH RES INST·Filed 2019·Granted May 11, 2021·3 cites·19 claims
- 0678USD976852SPower moduleIND TECH RES INST·Filed 2020·Granted Jan 31, 2023·8 cites·1 claims
- 0777US8519524B1Chip stacking structure and fabricating method of the chip stacking structureWU SHENG-TSAI·Filed 2012·Granted Aug 27, 2013·6 cites·31 claims
- 0870US11569217B2Image sensor package and manufacturing method thereofIND TECH RES INST·Filed 2022·Granted Jan 31, 2023·0 cites·3 claims
- 0967US12074137B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2023·Granted Aug 27, 2024·0 cites·11 claims
- 1065US12500174B2Power modulePOWERX SEMICONDUCTOR CORP·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 1165US9448121B2Measurement method, measurement apparatus, and computer program productIND TECH RES INST·Filed 2013·Granted Sep 20, 2016·2 cites·49 claims
- 1258US11587905B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted Feb 21, 2023·0 cites·8 claims
- 1357US12381133B2Power semiconductor deviceIND TECH RES INST·Filed 2022·Granted Aug 5, 2025·0 cites·10 claims
- 1454US11646270B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted May 9, 2023·0 cites·20 claims
- 1552US12009341B2Integrated antenna package structureIND TECH RES INST·Filed 2021·Granted Jun 11, 2024·0 cites·18 claims
- 1652US10390390B2Electronic apparatus and light-emitting module driving circuit thereofPEGATRON CORP·Filed 2018·Granted Aug 20, 2019·0 cites·10 claims
- 1747US10540474B2Chip temperature computation method and chip temperature computation deviceIND TECH RES INST·Filed 2018·Granted Jan 21, 2020·0 cites·15 claims
- 1842US2013234325A1Filled through-silicon via and the fabrication method thereofIND TECH RES INST·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →