Inventor · disambiguated record
Hiroaki Kurihara
Also filed as: KURIHARA HIROAKI
17 granted patents·11 pending applications·37 citations·filing 1997–2025
90Inventor score
Files withMITSUI MINING & SMELTING CO10PANASONIC IP MAN CO LTD5SHOWA CORP4FUJITSU LTD2MITSUI MINING & SMELTING CO LTD2
Top patents by PatentIndex Score
28 records- 0184US9543065B2Noncontact electric power transmission equipmentPANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 10, 2017·5 cites·1 claims
- 0275US12399001B2Method for measuring surface parameter of copper foil, and method for sorting copper foilMITSUI MINING & SMELTING CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·11 claims
- 0375US11332186B2Failure detection device and electric power steering apparatusSHOWA CORP·Filed 2020·Granted May 17, 2022·1 cites·19 claims
- 0475US10369858B2Suspension controller and suspension apparatusSHOWA CORP·Filed 2017·Granted Aug 6, 2019·2 cites·19 claims
- 0574US12222201B2Method for measuring surface parameter of copper foil, method for sorting copper foil, and method for producing surface-treated copper foilMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·10 claims
- 0674US10328761B2Suspension controller and suspension apparatusSHOWA CORP·Filed 2017·Granted Jun 25, 2019·3 cites·12 claims
- 0768US8734578B2Dust collecting systemMIKI TADASHI·Filed 2010·Granted May 27, 2014·4 cites·11 claims
- 0866US7932470B2Printed wiring boardMITSUI MINING & SMELTING CO·Filed 2007·Granted Apr 26, 2011·3 cites·20 claims
- 0962US9555713B2Contactless power transmission devicePANASONIC CORP·Filed 2014·Granted Jan 31, 2017·2 cites·4 claims
- 1060US7830667B2Flexible wiring substrate and method for producing the sameMITSUI MINING & SMELTING CO·Filed 2008·Granted Nov 9, 2010·1 cites·6 claims
- 1157US10645809B2Surface-treated copper foil, method for producing same, copper-clad laminate for printed wiring board, and printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted May 5, 2020·0 cites·12 claims
- 1257US2025378237A1Information processing method and information processing apparatusFUJITSU LTD·Filed 2025·Application pending·0 cites
- 1354US11299196B2Failure detection device and electric power steering apparatusSHOWA CORP·Filed 2019·Granted Apr 12, 2022·0 cites·18 claims
- 1453US2024126828A1Computer-readable recording medium storing detection program, detection method, and detection apparatusFUJITSU LTD·Filed 2023·Application pending·0 cites
- 1551US2025171076A1Control unit and steering deviceHITACHI ASTEMO LTD·Filed 2022·Application pending·0 cites
- 1650US11085654B2Outdoor unit for air conditionerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 10, 2021·0 cites·16 claims
- 1750US7425683B2Flexible wiring base material and process for producing the sameMITSUI MINING & SMELTING CO·Filed 2003·Granted Sep 16, 2008·3 cites·8 claims
- 1849US9704643B2Contactless power transmission device, and power feeder and power receiver for use in the samePANASONIC CORP·Filed 2014·Granted Jul 11, 2017·0 cites·11 claims
- 1948US6322904B1Copper foil for printed circuit boardsMITSUI MINING & SMELTING CO·Filed 1997·Granted Nov 27, 2001·13 cites·11 claims
- 2047US10014106B2Coil for non-contact power transmission system and non-contact power transmission systemPANASONIC IP MAN CO LTD·Filed 2015·Granted Jul 3, 2018·0 cites·4 claims
- 2143US2008063838A1Film Carrier Tape for Mounting Electronic Components and Method of Manufacturing the Film Carrier TapeMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 2242US2008236872A1Printed Wiring Board, Process For Producing the Same and Semiconductor DeviceMITSUI MINING & SMELTING CO·Filed 2005·Application pending·0 cites
- 2337US2015332827A1Non-contact power transmission systemPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 2437US2015332848A1Coil for non-contact power transmission system and non-contact power transmission systemPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 2537US2015332847A1Non-contact power transmission systemPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 2635US2008006441A1Wiring board and semiconductor device excellent in folding enduranceMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 2734US2007098910A1Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tapeMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 2834US2007090086A1Two-layer flexible printed wiring board and method for manufacturing the two-layer flexible printed wiring boardMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →