Inventor · disambiguated record
In Won O
Also filed as: O IN WON
5 granted patents·2 pending applications·16 citations·filing 2011–2022
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0178US8823185B2Semiconductor packagesO IN WON·Filed 2011·Granted Sep 2, 2014·9 cites·19 claims
- 0269US8981514B2Semiconductor package having a blocking pattern between a light transmissive cover and a substrate, and method for fabricating the sameRYU HAN-SUNG·Filed 2012·Granted Mar 17, 2015·3 cites·19 claims
- 0368US9542978B2Semiconductor package with terminals adjacent sides and cornersSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 10, 2017·2 cites·15 claims
- 0465US9059067B2Semiconductor device with interposer and method manufacturing sameCHOI YUN-SEOK·Filed 2011·Granted Jun 16, 2015·2 cites·16 claims
- 0552US11166368B2Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 2, 2021·0 cites·20 claims
- 0649US2023047026A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0732US2013264703A1Semiconductor packages and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →