Inventor · disambiguated record
Kenichi Kamiyama
Also filed as: KAMIYAMA KENICHI
8 granted patents·1 pending application·21 citations·filing 2004–2009
82Inventor score
Top patents by PatentIndex Score
9 records- 0179US7964289B2Formation method of metal layer on resin layer, printed wiring board, and production method thereofHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jun 21, 2011·5 cites·21 claims
- 0270US7615277B2Formation method of metal layer on resin layer, printed wiring board, and production method thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 10, 2009·10 cites·18 claims
- 0369US7427034B2Information processing apparatus and loop antennaSONY CORP·Filed 2006·Granted Sep 23, 2008·4 cites·7 claims
- 0462US7629045B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2005·Granted Dec 8, 2009·2 cites·19 claims
- 0562US2008138505A1Formation method of metal layer on resin layer, printed wiring board, and production method thereofTAKAI KENJI·Filed 2008·Application pending·0 cites
- 0654US8815334B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardTAKAI KENJI·Filed 2009·Granted Aug 26, 2014·0 cites·7 claims
- 0754US7818877B2Formation method of metal layer on resin layerHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 26, 2010·0 cites·12 claims
- 0853US7862889B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jan 4, 2011·0 cites·18 claims
- 0946US7729660B2Communication device, non-contact type IC card mounting same, and information apparatusSONY CORP·Filed 2006·Granted Jun 1, 2010·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →