Inventor · disambiguated record
Stuart E. Wilson
Also filed as: WILSON STUART · WILSON STUART E
12 granted patents·1 pending application·290 citations·filing 1999–2014
92Inventor score
Top patents by PatentIndex Score
13 records- 0194US6407843B1System and method for spectrally efficient transmission of digital data over optical fiberKESTREL SOLUTIONS INC·Filed 2000·Granted Jun 18, 2002·57 cites·2 claims
- 0293US7489524B2Assembly including vertical and horizontal joined circuit panelsTESSERA INC·Filed 2005·Granted Feb 10, 2009·40 cites·26 claims
- 0392US7176043B2Microelectronic packages and methods thereforTESSERA INC·Filed 2004·Granted Feb 13, 2007·69 cites·54 claims
- 0490US6529303B1Optical communications networks utilizing frequency division multiplexingKESTREL SOLUTIONS INC·Filed 1999·Granted Mar 4, 2003·90 cites·58 claims
- 0583US7545029B2Stack microelectronic assembliesTESSERA INC·Filed 2006·Granted Jun 9, 2009·13 cites·49 claims
- 0681US7554206B2Microelectronic packages and methods thereforTESSERA INC·Filed 2006·Granted Jun 30, 2009·9 cites·13 claims
- 0772US8630658B2Wearable ultra-thin miniaturized mobile communicationsWILSON STUART E·Filed 2012·Granted Jan 14, 2014·3 cites·11 claims
- 0866US8155663B2Wearable ultra-thin miniaturized mobile communicationsWILSON STUART E·Filed 2007·Granted Apr 10, 2012·2 cites·14 claims
- 0963US7709297B2Microelectronic package with thermal accessTESSERA INC·Filed 2006·Granted May 4, 2010·2 cites·11 claims
- 1062US8034665B2Microelectronic package with thermal accessTESSERA INC·Filed 2010·Granted Oct 11, 2011·1 cites·4 claims
- 1155US9319499B2Wearable ultra-thin miniaturized mobile communicationsDIGITALOPTICS CORP EUROPE LTD·Filed 2014·Granted Apr 19, 2016·0 cites·19 claims
- 1245US2003210909A1Optical communications networks utilizing frequency division multiplexingFiled 2003·Application pending·0 cites
- 1343US7151502B2Phased antenna array moduleTESSERA INC·Filed 2004·Granted Dec 19, 2006·4 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →