Inventor · disambiguated record
Tetsuichiro Kasahara
Also filed as: KASAHARA TETSUICHIRO
14 granted patents·4 pending applications·71 citations·filing 1999–2022
89Inventor score
Files withSHINKO ELECTRIC IND CO18
Top patents by PatentIndex Score
18 records- 0179US9698084B2Semiconductor device and lead frame having two leads welded togetherSHINKO ELECTRIC IND CO·Filed 2015·Granted Jul 4, 2017·4 cites·8 claims
- 0273US10096539B2Lead frame and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Oct 9, 2018·2 cites·11 claims
- 0373US6631847B1IC card, antenna for IC card, and antenna frame thereforSHINKO ELECTRIC IND CO·Filed 2000·Granted Oct 14, 2003·28 cites·25 claims
- 0463US7237319B2Method of manufacturing a plane coilSHINKO ELECTRIC IND CO·Filed 2004·Granted Jul 3, 2007·15 cites·6 claims
- 0561US11923282B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2021·Granted Mar 5, 2024·0 cites·4 claims
- 0658US6797543B2Process for manufacturing IC cardSHINKO ELECTRIC IND CO·Filed 2003·Granted Sep 28, 2004·8 cites·17 claims
- 0755US10586758B2Substrate-with-supportSHINKO ELECTRIC IND CO·Filed 2018·Granted Mar 10, 2020·0 cites·8 claims
- 0853US6875630B2Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Apr 5, 2005·5 cites·5 claims
- 0952US11398432B2Wiring substrate and electronic deviceSHINKO ELECTRIC IND CO·Filed 2020·Granted Jul 26, 2022·0 cites·8 claims
- 1051US11647584B2Circuit board, and electronic deviceSHINKO ELECTRIC IND CO·Filed 2021·Granted May 9, 2023·0 cites·4 claims
- 1149US2018331026A1Wiring substrateSHINKO ELECTRIC IND CO·Filed 2018·Application pending·0 cites
- 1249US2022375831A1Lead frame, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2022·Application pending·0 cites
- 1346US10964553B2Manufacturing method of semiconductor device and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2019·Granted Mar 30, 2021·0 cites·3 claims
- 1445US7259044B2Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Aug 21, 2007·2 cites·15 claims
- 1543US9972560B2Lead frame and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted May 15, 2018·0 cites·13 claims
- 1637US6630370B2Process for manufacturing IC cardSHINKO ELECTRIC IND CO·Filed 1999·Granted Oct 7, 2003·7 cites·7 claims
- 1730US2004080025A1Lead frame, method of manufacturing the same, and semiconductor device manufactured with the sameSHINKO ELECTRIC IND CO·Filed 2003·Application pending·0 cites
- 1827US2004046237A1Lead frame and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →