Inventor · disambiguated record
James H. Kleffner
Also filed as: KLEFFNER JAMES H
4 granted patents·676 citations·filing 1998–2003
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0194US6077726AMethod and apparatus for stress relief in solder bump formation on a semiconductor deviceMOTOROLA INC·Filed 1998·Granted Jun 20, 2000·225 cites·13 claims
- 0294US5943597ABumped semiconductor device having a trench for stress reliefMOTOROLA INC·Filed 1998·Granted Aug 24, 1999·261 cites·13 claims
- 0392US6815254B2Semiconductor package with multiple sides having package contactsFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Nov 9, 2004·164 cites·28 claims
- 0474US7479407B2Digital and RF system and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 20, 2009·26 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →