Inventor · disambiguated record
Yuji Tosaka
Also filed as: TOSAKA YUJI
5 granted patents·3 pending applications·0 citations·filing 2016–2022
58Inventor score
Top patents by PatentIndex Score
8 records- 0157US12466946B2Method for producing FRP precursorRESONAC CORP·Filed 2021·Granted Nov 11, 2025·0 cites·19 claims
- 0257US2024247120A1Prepreg, laminated plate, metal-clad laminated plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminated plateRESONAC CORP·Filed 2022·Application pending·0 cites
- 0355US10933562B2Method for producing FRP precursor and device for producing sameHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 2, 2021·0 cites·10 claims
- 0450US11497117B2Metal-clad laminate, printed wiring board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2017·Granted Nov 8, 2022·0 cites·21 claims
- 0544US2019037691A1Frp precursor, laminated plate, metal-clad laminate, printed circuit board, semiconductor package, and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0643US2018345539A1Method for producing frp precursor and device for producing sameHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 0740US10856423B2Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit boardHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 1, 2020·0 cites·11 claims
- 0836US11040517B2Printed wiring board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2017·Granted Jun 22, 2021·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →