Inventor · disambiguated record
Naofumi Kosaka
Also filed as: KOSAKA NAOFUMI
10 granted patents·10 pending applications·1 citations·filing 2012–2024
76Inventor score
Top patents by PatentIndex Score
20 records- 0185US2024368435A1Pressure-sensitive adhesive sheet and method for peeling pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 0272US12071573B2Pressure-sensitive adhesive sheet and method for peeling pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2019·Granted Aug 27, 2024·0 cites·20 claims
- 0370US9508971B2Gas-permeable filter provided with oil repellencyIKEYAMA YOSHIKI·Filed 2012·Granted Nov 29, 2016·1 cites·6 claims
- 0469US12215258B2Pressure-sensitive adhesive sheet and use thereofNITTO DENKO CORP·Filed 2020·Granted Feb 4, 2025·0 cites·10 claims
- 0568US2024269780A1Bonding sheet and method for producing sameNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0668US2024139887A1Bonding sheetNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0765US11795350B2Optical pressure-sensitive adhesive composition and use thereofNITTO DENKO CORP·Filed 2019·Granted Oct 24, 2023·0 cites·19 claims
- 0864US12492327B2Photo-crosslinkable pressure-sensitive adhesive and use thereofNITTO DENKO CORP·Filed 2020·Granted Dec 9, 2025·0 cites·10 claims
- 0963US2024409788A1Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet using said pressure-sensitive adhesive compositionNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1062US2024392172A1Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet using said pressure-sensitive adhesive compositionNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1159US12435249B2Method for separating joined objectNITTO DENKO CORP·Filed 2021·Granted Oct 7, 2025·0 cites·12 claims
- 1259US2022282129A1Optical pressure-sensitive adhesive compositionNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1357US11970644B2Method for peeling pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2019·Granted Apr 30, 2024·0 cites·7 claims
- 1453US2025157975A1Semiconductor device and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2023·Application pending·0 cites
- 1553US2023144464A1Pressure-sensitive adhesive sheet and use thereofNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 1653US2025219004A1Connecting structureNITTO DENKO CORP·Filed 2023·Application pending·0 cites
- 1750US10570320B2Adhesive member to be adhesively fixed through pressureNITTO DENKO CORP·Filed 2016·Granted Feb 25, 2020·0 cites·43 claims
- 1849US12263662B2Method for producing laminate of two-dimensional material and laminateNITTO DENKO CORP·Filed 2020·Granted Apr 1, 2025·0 cites·16 claims
- 1948US11236254B2SeparatorNITTO DENKO CORP·Filed 2017·Granted Feb 1, 2022·0 cites·5 claims
- 2039US2020270483A1Pressure-bonding pressure-sensitive adhesive memberNITTO DENKO CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →