Inventor · disambiguated record
Byungmoon Bae
Also filed as: BAE BYUNGMOON
6 granted patents·4 citations·filing 2016–2023
71Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0190US11676914B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0273US10032706B2Package substratesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 24, 2018·2 cites·13 claims
- 0368US12062626B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·19 claims
- 0465US11854892B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·17 claims
- 0560US11322405B2Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by themSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 0653US10256181B2Package substratesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 9, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →