Inventor · disambiguated record
Hendrik Bouman
Also filed as: BOUMAN HENDRIK
7 granted patents·9 citations·filing 2012–2021
75Inventor score
Top patents by PatentIndex Score
7 records- 0179US9070695B2Integrated circuit with sensor and method of manufacturing such an integrated circuitDAAMEN ROEL·Filed 2012·Granted Jun 30, 2015·6 cites·14 claims
- 0266US10192842B2Package for environmental parameter sensors and method for manufacturing a package for environmental parameter sensorsAMS INT AG·Filed 2014·Granted Jan 29, 2019·2 cites·11 claims
- 0365US12180066B2Sensor package and method of producing the sensor packageSCIOSENSE BV·Filed 2021·Granted Dec 31, 2024·0 cites·16 claims
- 0463US9385099B2Die interconnectNXP BV·Filed 2014·Granted Jul 5, 2016·1 cites·14 claims
- 0551US11001495B2Sensor package and method of producing the sensor packageSCIOSENSE BV·Filed 2017·Granted May 11, 2021·0 cites·19 claims
- 0646US11293821B2Pressure sensor moduleSCIOSENSE BV·Filed 2017·Granted Apr 5, 2022·0 cites·18 claims
- 0737US9862600B2Chip structureAMS INT AG·Filed 2015·Granted Jan 9, 2018·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →