Inventor · disambiguated record
Masaya Iida
Also filed as: IIDA MASAYA
18 granted patents·278 citations·filing 1995–2011
95Inventor score
Top patents by PatentIndex Score
18 records- 0197US6809399B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Oct 26, 2004·109 cites·10 claims
- 0292US7910427B1Semiconductor integrated circuit device and process for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Mar 22, 2011·8 cites·7 claims
- 0388US7456486B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Nov 25, 2008·8 cites·19 claims
- 0488US7253051B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2005·Granted Aug 7, 2007·8 cites·17 claims
- 0586US6548885B2Semiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 2001·Granted Apr 15, 2003·22 cites·43 claims
- 0683US5754467ASemiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 1995·Granted May 19, 1998·38 cites·34 claims
- 0782US5946565ASemiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 1997·Granted Aug 31, 1999·34 cites·58 claims
- 0881US7049680B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted May 23, 2006·14 cites·20 claims
- 0973US7511377B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Mar 31, 2009·2 cites·36 claims
- 1072US8133780B2Semiconductor integrated circuit device and process for manufacturing the sameIKEDA SHUJI·Filed 2011·Granted Mar 13, 2012·1 cites·18 claims
- 1165US5607866AMethod of fabricating a semiconductor device having silicide layers for electrodesHITACHI LTD·Filed 1995·Granted Mar 4, 1997·26 cites·15 claims
- 1258US7834420B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Nov 16, 2010·0 cites·26 claims
- 1356US7397123B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jul 8, 2008·0 cites·19 claims
- 1455US8093681B2Semiconductor integrated circuit device and process for manufacturing the sameIKEDA SHUJI·Filed 2011·Granted Jan 10, 2012·0 cites·11 claims
- 1554US6211004B1Semiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 1999·Granted Apr 3, 2001·8 cites·27 claims
- 1644US7022568B2Semiconductor integrated circuit device and process for manufacturing the sameHITACHI ULSI ENG CORP·Filed 2004·Granted Apr 4, 2006·0 cites·23 claims
- 1744US7023071B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Apr 4, 2006·0 cites·30 claims
- 1839US8368151B2Semiconductor deviceHITACHI LTD·Filed 2009·Granted Feb 5, 2013·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →