Inventor · disambiguated record
Wha-Su Sin
Also filed as: SIN WHA-SU
11 granted patents·14 pending applications·70 citations·filing 2004–2011
88Inventor score
Top patents by PatentIndex Score
25 records- 0191US7420814B2Package stack and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 2, 2008·25 cites·18 claims
- 0281US7745932B2Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 29, 2010·11 cites·39 claims
- 0373US7576438B2Printed circuit board and method thereof and a solder ball land and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·5 cites·32 claims
- 0472US7713788B2Method of manufacturing semiconductor package using redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 11, 2010·5 cites·24 claims
- 0570US7427558B2Method of forming solder ball, and fabricating method and structure of semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 23, 2008·4 cites·20 claims
- 0666US7235887B2Semiconductor package with improved chip attachment and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 26, 2007·16 cites·25 claims
- 0762US7452753B2Method of processing a semiconductor wafer for manufacture of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 18, 2008·2 cites·10 claims
- 0859US8039972B2Printed circuit board and method thereof and a solder ball land and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 18, 2011·1 cites·32 claims
- 0956US7696615B2Semiconductor device having pillar-shaped terminalSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 13, 2010·1 cites·15 claims
- 1049US2009200362A1Method of manufacturing a semiconductor packageJUNG KY-HYUN·Filed 2009·Application pending·0 cites
- 1147US7863161B2Method of cutting a waferSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 4, 2011·0 cites·13 claims
- 1247US2008042279A1Mounting structure of semiconductor device having flux and under fill resin layer and method of mounting semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1347US2008061434A1Substrate for semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1445US2008110477A1Cleaning solutions and methods of cleaning boards using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1544US2008251949A1Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1643US2008070382A1Fixing apparatus for semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1742US2007057410A1Method of fabricating wafer chipsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1841US2008012096A1Semiconductor chip and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1940US8115323B2Semiconductor package and method of manufacturing the semiconductor packageSIN WHA-SU·Filed 2008·Granted Feb 14, 2012·0 cites·18 claims
- 2040US2008111230A1Wiring film having wire, semiconductor package including the wiring film, and method of fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2139US2007052094A1Semiconductor wafer level chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2235US2012013007A1Package-on-package semiconductor package having spacers disposed between two package substratesHWANG HYUN-IK·Filed 2011·Application pending·0 cites
- 2333US2011124273A1Wafer polishing apparatus for adjusting height of wheel tipSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 2430US2011024919A1Wiring substrate for a semiconductor chip and semiconductor package having the wiring substrateKANG TAE-GYU·Filed 2010·Application pending·0 cites
- 2529US2006003491A1Apparatus for ejecting relatively thin IC chip from semiconductor waferKIM GOON-WOO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →