Inventor · disambiguated record
Mark Sackett
Also filed as: SACKETT MARK
4 granted patents·25 citations·filing 1994–2023
70Inventor score
Top patents by PatentIndex Score
4 records- 0173US12211778B2Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structureSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·31 claims
- 0273US8827095B1Expandable-collapsible safeLOCKER STORAGE SOLUTIONS LLC·Filed 2013·Granted Sep 9, 2014·9 cites·20 claims
- 0366US11764136B2Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structureSTATS CHIPPAC PTE LTD·Filed 2021·Granted Sep 19, 2023·0 cites·31 claims
- 0459US5471730AMethod for refurbishing worn turret punch press boresFiled 1994·Granted Dec 5, 1995·16 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →