Inventor · disambiguated record
Pyoungwan Kim
Also filed as: KIM PYOUNGWAN
9 granted patents·8 pending applications·68 citations·filing 2009–2024
84Inventor score
Top patents by PatentIndex Score
17 records- 0195US11309228B2Packaged semiconductor devices having enhanced thermal transport and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 19, 2022·6 cites·18 claims
- 0292US8026592B2Through-silicon via structures including conductive protective layersSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 27, 2011·45 cites·18 claims
- 0390US10622340B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 14, 2020·9 cites·18 claims
- 0488US10361177B2Semiconductor package having a molding layer including a molding cavity and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 23, 2019·6 cites·20 claims
- 0576US11133296B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 28, 2021·2 cites·18 claims
- 0668US11557574B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 0760US2025167089A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0860US2025079395A1Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0960US2025210566A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1060US2025201762A1Method of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1159US11075189B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 1258US2024243054A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1349US11257786B2Semiconductor package including molding member, heat dissipation member, and reinforcing memberSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·19 claims
- 1447US11482507B2Semiconductor package having molding member and heat dissipation memberSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·11 claims
- 1540US2011318917A1Methods of forming through-silicon via structures including conductive protective layersYOON MINSEUNG·Filed 2011·Application pending·0 cites
- 1639US2013126219A1Multi-ply circuit board with fiber bundlesSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1732US2016099213A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →