Inventor · disambiguated record
Chunjian Ni
Also filed as: NI CHUNJIAN
10 granted patents·7 pending applications·153 citations·filing 2010–2022
89Inventor score
Top patents by PatentIndex Score
17 records- 0196US8638559B2User-serviceable liquid DIMM cooling systemBARINA RICHARD M·Filed 2011·Granted Jan 28, 2014·46 cites·19 claims
- 0296US8587943B2Liquid-cooling memory modules with liquid flow pipes between memory module socketsBARINA RICHARD M·Filed 2011·Granted Nov 19, 2013·49 cites·16 claims
- 0390US8139354B2Independently operable ionic air moving devices for zonal control of air flow through a chassisJUNE MICHAEL S·Filed 2010·Granted Mar 20, 2012·17 cites·26 claims
- 0488US8444754B2Electrostatic control of air flow to the inlet opening of an axial fanJUNE MICHAEL S·Filed 2010·Granted May 21, 2013·10 cites·11 claims
- 0585US8613793B2Electrostatic control of air flow to the inlet opening of an axial fanIBM·Filed 2013·Granted Dec 24, 2013·6 cites·13 claims
- 0683US10571980B2Hybrid cooling control of a computing systemHEWLETT PACKARD ENTPR DEV LP·Filed 2015·Granted Feb 25, 2020·5 cites·9 claims
- 0781US9507391B2Heat sink with orientable finsBUSCH DIANE S·Filed 2011·Granted Nov 29, 2016·10 cites·14 claims
- 0876US8807204B2Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter arrayJUNE MICHAEL S·Filed 2010·Granted Aug 19, 2014·5 cites·11 claims
- 0972US9875951B2Heat sink with orientable finsGLOVER TROY W·Filed 2011·Granted Jan 23, 2018·5 cites·20 claims
- 1058US11871540B2Optimizing waste heat recovery and return water temperature using dynamic flow control based on server power profiles and cooling capacity of serversLENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD·Filed 2021·Granted Jan 9, 2024·0 cites·18 claims
- 1157US2020159297A1Hybrid cooling control of a computing systemHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Application pending·0 cites
- 1253US2024141555A1Liquid colored oil and colored polyamide fiberTORAY INDUSTRIES·Filed 2022·Application pending·0 cites
- 1352US2014230234A1Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter arrayIBM·Filed 2014·Application pending·0 cites
- 1449US2020315070A1Auxiliary cooling redundancy for components using actuating fan packLENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD·Filed 2019·Application pending·0 cites
- 1540US2020017995A1Hollow polyester long fiber and preparation method thereforTORAY INDUSTRIES·Filed 2017·Application pending·0 cites
- 1639US2013168068A1Thermally enhanced cold plate having high conductivity thermal transfer pathsHUANG ZHEN·Filed 2011·Application pending·0 cites
- 1732US2013133859A1Heat sink with heat bus and fin structureGLOVER TROY W·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →