Inventor · disambiguated record
Ming-Hong Hsieh
Also filed as: HSIEH MING-HONG
12 granted patents·3 pending applications·31 citations·filing 2001–2024
86Inventor score
Top patents by PatentIndex Score
15 records- 0189US11616002B2Through-circuit vias in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·2 cites·20 claims
- 0281US8648592B2Semiconductor device components and methodsLIN BI-LING·Filed 2011·Granted Feb 11, 2014·7 cites·20 claims
- 0379US12293959B2Through-circuit Vias in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 6, 2025·0 cites·20 claims
- 0478US7217663B2Via hole and trench structures and fabrication methods thereof and dual damascene structures and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 15, 2007·7 cites·14 claims
- 0578US2024387331A1Through-Circuit Vias In Interconnect StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0675US12243805B2Through-circuit vias in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 0775US6999081B1Method and apparatus for displaying production data for improved manufacturing decision makingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 14, 2006·11 cites·20 claims
- 0875US2024387316A1Semiconductor arrangement and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0972US12131992B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1069US12154838B2Semiconductor arrangement and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 1163US11830806B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 1256US2025362338A1Method and system for thermal-aware electromigration evaluation and circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1353US9875964B2Semiconductor device components and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 23, 2018·0 cites·21 claims
- 1451US7436009B2Via structures and trench structures and dual damascene structuresTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Oct 14, 2008·0 cites·8 claims
- 1548US6974505B2Tool for cleaning substratesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 13, 2005·4 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →