Inventor · disambiguated record
Hideharu Sakoda
Also filed as: SAKODA HIDEHARU
25 granted patents·1 pending application·1,897 citations·filing 1993–2004
97Inventor score
Top patents by PatentIndex Score
26 records- 0199US6072239ADevice having resin package with projectionsFUJITSU LTD·Filed 1996·Granted Jun 6, 2000·241 cites·14 claims
- 0298US5656550AMethod of producing a semicondutor device having a lead portion with outer connecting terminalFUJITSU LTD·Filed 1996·Granted Aug 12, 1997·366 cites·24 claims
- 0396US6573121B2Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 2001·Granted Jun 3, 2003·126 cites·15 claims
- 0496US6376921B1Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 1998·Granted Apr 23, 2002·120 cites·11 claims
- 0594US6025650ASemiconductor device including a frame terminalFUJITSU LTD·Filed 1997·Granted Feb 15, 2000·220 cites·15 claims
- 0693US6159770AMethod and apparatus for fabricating semiconductor deviceFUJITSU LTD·Filed 1998·Granted Dec 12, 2000·212 cites·9 claims
- 0792US6255740B1Semiconductor device having a lead portion with outer connecting terminalsFUJITSU LTD·Filed 1997·Granted Jul 3, 2001·122 cites·7 claims
- 0891US7064645B2Electronic deviceFUJITSU LTD·Filed 2002·Granted Jun 20, 2006·46 cites·10 claims
- 0984US5930603AMethod for producing a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Jul 27, 1999·77 cites·10 claims
- 1083US5804468AProcess for manufacturing a packaged semiconductor having a divided leadframe stageFUJITSU LTD·Filed 1995·Granted Sep 8, 1998·65 cites·4 claims
- 1183US5497032ASemiconductor device and lead frame thereforeFUJITSU LTD·Filed 1994·Granted Mar 5, 1996·65 cites·45 claims
- 1279US7192798B2Fingerprint sensor apparatus and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Mar 20, 2007·28 cites·10 claims
- 1377US5703398ASemiconductor integrated circuit device and method of producing the semiconductor integrated circuit deviceFUJITSU LTD·Filed 1996·Granted Dec 30, 1997·51 cites·15 claims
- 1477US5569625AProcess for manufacturing a plural stacked leadframe semiconductor deviceFUJITSU LTD·Filed 1994·Granted Oct 29, 1996·47 cites·8 claims
- 1574US6339261B1Semiconductor device and process of producing sameSHINKO ELECTRIC IND CO·Filed 2000·Granted Jan 15, 2002·22 cites·3 claims
- 1668US6670221B2Semiconductor device having a built-in contact-type sensor and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Dec 30, 2003·14 cites·10 claims
- 1756US6856017B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 1999·Granted Feb 15, 2005·13 cites·19 claims
- 1856US6700198B2Resin for semiconductor wireSHINKO ELECTRIC IND CO·Filed 2001·Granted Mar 2, 2004·8 cites·1 claims
- 1955US6777250B1Manufacture of wafer level semiconductor device with quality markings on the sealing resinFUJITSU LTD·Filed 2000·Granted Aug 17, 2004·6 cites·5 claims
- 2051US5399804ASemiconductor device and method of producing the sameFUJITSU LTD·Filed 1993·Granted Mar 21, 1995·16 cites·15 claims
- 2147US7144754B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 2004·Granted Dec 5, 2006·1 cites·7 claims
- 2247US5808357ASemiconductor device having resin encapsulated package structureFUJITSU LTD·Filed 1995·Granted Sep 15, 1998·11 cites·14 claims
- 2341US6271583B1Semiconductor device having resin encapsulated package structureFUJITSU LTD·Filed 1998·Granted Aug 7, 2001·7 cites·10 claims
- 2439US6348416B1Carrier substrate for producing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1999·Granted Feb 19, 2002·9 cites·9 claims
- 2539US2004235271A1Manufacture of wafer level semiconductor device with quality markings on the sealing resinFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2636US6031280ASemiconductor device having resin encapsulated package structureFUJITSU LTD·Filed 1998·Granted Feb 29, 2000·4 cites·4 claims
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