Inventor · disambiguated record
Chikara Yamashita
Also filed as: YAMASHITA CHIKARA
10 granted patents·8 pending applications·660 citations·filing 1994–2023
92Inventor score
Top patents by PatentIndex Score
18 records- 0196US5668405ASemiconductor device with a film carrier tapeNEC CORP·Filed 1995·Granted Sep 16, 1997·289 cites·8 claims
- 0292US5763939ASemiconductor device having a perforated base film sheetNEC CORP·Filed 1995·Granted Jun 9, 1998·157 cites·12 claims
- 0379US8151520B2Vehicle sash door and protector and center channel for the sameYAMASHITA CHIKARA·Filed 2008·Granted Apr 10, 2012·11 cites·10 claims
- 0478US6432807B1Method of forming solder bumps on a semiconductor device using bump transfer plateNEC CORP·Filed 2000·Granted Aug 13, 2002·24 cites·4 claims
- 0577US5789820AMethod for manufacturing heat radiating resin-molded semiconductor deviceNEC CORP·Filed 1997·Granted Aug 4, 1998·53 cites·16 claims
- 0677US5509203AMethod for manufacturing a sheet formed connector for inspection of an integrated circuitNEC CORP·Filed 1994·Granted Apr 23, 1996·57 cites·3 claims
- 0770US5777387ASemiconductor device constructed by mounting a semiconductor chip on a film carrier tapeNEC CORP·Filed 1997·Granted Jul 7, 1998·44 cites·6 claims
- 0866US6501175B2Semiconductor device with semiconductor chip on flexible tapeNEC CORP·Filed 2001·Granted Dec 31, 2002·14 cites·9 claims
- 0956US2024190222A1Vehicle door structureSUBARU CORP·Filed 2023·Application pending·0 cites
- 1051US2022259701A1Copper alloy trolley wireMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
- 1147US2019144974A1Copper alloy, copper alloy ingot, solid solution material of copper alloy, and copper alloy trolley wire, method of manufacturing copper alloy trolley wireMITSUBISHI MATERIALS CORP·Filed 2017·Application pending·0 cites
- 1243US5643802AMethod of producing a semiconductor device by gang bonding followed by point bondingNEC CORP·Filed 1996·Granted Jul 1, 1997·11 cites·6 claims
- 1343US2005035606A1Handle for opening and closing shojiMEIKO OF TAMPA INC·Filed 2003·Application pending·0 cites
- 1441US8522485B2Vehicle sash door and protector and center channel for the sameYAMASHITA CHIKARA·Filed 2012·Granted Sep 3, 2013·0 cites·4 claims
- 1537US2002173136A1Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereofNEC CORP·Filed 2002·Application pending·0 cites
- 1637US2002177295A1Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereofNEC CORP·Filed 2002·Application pending·0 cites
- 1737US2002173135A1Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereofNEC CORP·Filed 2002·Application pending·0 cites
- 1836US2005052035A1Door security latchFiled 2003·Application pending·0 cites
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