Inventor · disambiguated record
Kazuya Kitazawa
Also filed as: KITAZAWA KAZUYA
9 granted patents·2 pending applications·1 citations·filing 2013–2024
74Inventor score
Files withSENJU METAL INDUSTRY CO11
Top patents by PatentIndex Score
11 records- 0166US9902022B2Flux and solder pasteSENJU METAL INDUSTRY CO·Filed 2015·Granted Feb 27, 2018·1 cites·6 claims
- 0266US2024351148A1Flux, solder paste, and method of producing joined bodySENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 0364US12233484B2Flux and solder pasteSENJU METAL INDUSTRY CO·Filed 2021·Granted Feb 25, 2025·0 cites·13 claims
- 0464US11571771B2Soldering flux and soldering pasteSENJU METAL INDUSTRY CO·Filed 2018·Granted Feb 7, 2023·0 cites·4 claims
- 0561US12330244B2Flux, solder paste, and method for producing bonded bodySENJU METAL INDUSTRY CO·Filed 2023·Granted Jun 17, 2025·0 cites·6 claims
- 0661US11738415B2Flux, solder paste and method for producing soldered productSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 29, 2023·0 cites·12 claims
- 0755US10160064B2Flux, solder paste and solder jointSENJU METAL INDUSTRY CO·Filed 2013·Granted Dec 25, 2018·0 cites·13 claims
- 0854US11833620B2Flux and solder pasteSENJU METAL INDUSTRY CO·Filed 2019·Granted Dec 5, 2023·0 cites·6 claims
- 0952US2022127445A1Resin composition for soldering use, solder composition, flux cored solder, flux, and solder pasteSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 1050US12459060B2Solder pasteSENJU METAL INDUSTRY CO·Filed 2020·Granted Nov 4, 2025·0 cites·7 claims
- 1135US10632492B2Fluid discharge device, fluid discharge method, and fluid application deviceSENJU METAL INDUSTRY CO·Filed 2016·Granted Apr 28, 2020·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →