Inventor · disambiguated record
Tomoyuki Aoki
Also filed as: AOKI TOMOYUKI
55 granted patents·3 pending applications·677 citations·filing 1988–2021
99Inventor score
Files withSEMICONDUCTOR ENERGY LAB27HENKEL CORP9AOKI TOMOYUKI4PANASONIC IP MAN CO LTD4DOZEN YOSHITAKA2
Top patents by PatentIndex Score
58 records- 0196US7685706B2Method of manufacturing a semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Mar 30, 2010·37 cites·18 claims
- 0296US7667310B2Paper including semiconductor device and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted Feb 23, 2010·39 cites·24 claims
- 0394US7759788B2Semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Jul 20, 2010·30 cites·22 claims
- 0494US7335951B2Semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2004·Granted Feb 26, 2008·68 cites·119 claims
- 0593US8436354B2Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor deviceAOKI TOMOYUKI·Filed 2011·Granted May 7, 2013·13 cites·21 claims
- 0693US8432018B2Semiconductor device and manufacturing method of semiconductor deviceDOZEN YOSHITAKA·Filed 2011·Granted Apr 30, 2013·13 cites·16 claims
- 0793US7651932B2Method for manufacturing antenna and method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Jan 26, 2010·19 cites·13 claims
- 0892US8278663B2Paper including semiconductor device and manufacturing method thereofDOZEN YOSHITAKA·Filed 2011·Granted Oct 2, 2012·11 cites·26 claims
- 0992US7449372B2Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted Nov 11, 2008·24 cites·18 claims
- 1091US7879654B2Paper including semiconductor device and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2010·Granted Feb 1, 2011·10 cites·13 claims
- 1191US7632740B2Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Dec 15, 2009·17 cites·16 claims
- 1290US9508619B2Semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2013·Granted Nov 29, 2016·9 cites·20 claims
- 1390US8039353B2Semiconductor device and manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2010·Granted Oct 18, 2011·9 cites·12 claims
- 1489US8354962B2Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication systemSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Jan 15, 2013·18 cites·28 claims
- 1589US7504317B2Manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Mar 17, 2009·14 cites·13 claims
- 1688US8528827B2Antenna, semiconductor device, and method of manufacturing antennaAOKI TOMOYUKI·Filed 2011·Granted Sep 10, 2013·7 cites·20 claims
- 1788US7851886B2Semiconductor device and manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted Dec 14, 2010·12 cites·16 claims
- 1887US8227851B2Semiconductor deviceAOKI TOMOYUKI·Filed 2010·Granted Jul 24, 2012·7 cites·4 claims
- 1986US8459561B2Semiconductor device and method for manufacturing the sameAOKI TOMOYUKI·Filed 2008·Granted Jun 11, 2013·13 cites·20 claims
- 2086US7851278B2Semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted Dec 14, 2010·10 cites·40 claims
- 2185US7713836B2Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted May 11, 2010·13 cites·25 claims
- 2284US9111195B2Antenna, semiconductor device, and method of manufacturing antennaSEMICONDUCTOR ENERGY LAB·Filed 2013·Granted Aug 18, 2015·4 cites·17 claims
- 2384US7915058B2Substrate having pattern and method for manufacturing the same, and semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Mar 29, 2011·8 cites·14 claims
- 2484US7838993B2Semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Nov 23, 2010·7 cites·3 claims
- 2584US7670884B2Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2008·Granted Mar 2, 2010·11 cites·16 claims
- 2680US7767516B2Semiconductor device, manufacturing method thereof, and manufacturing method of antennaSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Aug 3, 2010·9 cites·24 claims
- 2780US5382295AMethod for cleaning aluminum and aluminum alloysHENKEL CORP·Filed 1991·Granted Jan 17, 1995·35 cites·20 claims
- 2875US8455753B2Solar cell and semiconductor device, and manufacturing method thereofNISHI KAZUO·Filed 2006·Granted Jun 4, 2013·6 cites·28 claims
- 2975US8030178B2Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2009·Granted Oct 4, 2011·4 cites·38 claims
- 3075US4980076AFluoride and chromium free acid etchant rinse for aluminumNIHON PARKERIZING·Filed 1989·Granted Dec 25, 1990·22 cites·19 claims
- 3174US8648439B2Semiconductor device and manufacturing method of semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2013·Granted Feb 11, 2014·2 cites·20 claims
- 3274US7994030B2Method for manufacturing antenna and method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2009·Granted Aug 9, 2011·4 cites·10 claims
- 3374US5336425AAcidic aluminum cleaner containing an oxidant and a nonionic surfactant stabilized by a glycolHENKEL CORP·Filed 1992·Granted Aug 9, 1994·26 cites·20 claims
- 3474US4927472AConversion coating solution for treating metal surfacesNIHON PARKERIZING·Filed 1988·Granted May 22, 1990·35 cites·12 claims
- 3572US8044499B2Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2009·Granted Oct 25, 2011·3 cites·20 claims
- 3669US9155204B2Method for manufacturing a wiring boardMARUYAMA JUNYA·Filed 2010·Granted Oct 6, 2015·2 cites·9 claims
- 3769US7875530B2Method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2006·Granted Jan 25, 2011·4 cites·40 claims
- 3868US7457975B2Information processing apparatus with a function for low-power operation by controlling a power supply to a recording section of a recording medium and a computer individuallyPANASONIC CORP·Filed 2005·Granted Nov 25, 2008·5 cites·14 claims
- 3964US12441856B2Resin sheet, prepreg, insulating resin member, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·6 claims
- 4063US8242585B2Semiconductor device and method for manufacturing the sameNISHI KAZUO·Filed 2010·Granted Aug 14, 2012·1 cites·40 claims
- 4162US8378484B2Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2007·Granted Feb 19, 2013·2 cites·17 claims
- 4261US12006433B2Thermosetting resin composition, resin sheet, laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Jun 11, 2024·0 cites·11 claims
- 4361US5603754AComposition and process for treating tinplate and aluminumHENKEL CORP·Filed 1994·Granted Feb 18, 1997·20 cites·20 claims
- 4458US2023101791A1Thermosetting resin composition, resin sheet, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 4556US6379552B1Method for resolving optical isomersTORAY INDUSTRIES·Filed 1999·Granted Apr 30, 2002·14 cites·27 claims
- 4655USD384605SAutomobile tireSUMITOMO RUBBER IND·Filed 1996·Granted Oct 7, 1997·8 cites·1 claims
- 4752US8357598B2Method for manufacturing antenna and method for manufacturing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2011·Granted Jan 22, 2013·0 cites·10 claims
- 4851US6059896AComposition and process for treating the surface of aluminiferous metalsHENKEL CORP·Filed 1996·Granted May 9, 2000·17 cites·20 claims
- 4951US5498300AComposition and process for treating tinplateHENKEL CORP·Filed 1993·Granted Mar 12, 1996·13 cites·20 claims
- 5049US10568201B2Multilayer printed wiring board and multilayer metal clad laminated boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Feb 18, 2020·0 cites·6 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →