Inventor · disambiguated record
Yuji Fukuoka
Also filed as: FUKUOKA YUJI
10 granted patents·2 pending applications·26 citations·filing 2008–2020
85Inventor score
Top patents by PatentIndex Score
12 records- 0190US10020243B2Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel systemTOYOTA ENG & MFG NORTH AMERICA·Filed 2016·Granted Jul 10, 2018·6 cites·20 claims
- 0285US10566265B2Electronic assemblies having a cooling chip layer with impingement channels and through substrate viasTOYOTA ENG & MFG NORTH AMERICA·Filed 2017·Granted Feb 18, 2020·5 cites·9 claims
- 0380US10615100B2Electronics assemblies and cooling structures having metalized exterior surfaceTOYOTA ENG & MFG NORTH AMERICA·Filed 2017·Granted Apr 7, 2020·3 cites·14 claims
- 0478US10121729B2Power electronics assemblies having a semiconductor device with metallized embedded cooling channelsTOYOTA ENG & MFG NORTH AMERICA·Filed 2016·Granted Nov 6, 2018·3 cites·16 claims
- 0577US9722075B2Semiconductor deviceSOENO AKITAKA·Filed 2014·Granted Aug 1, 2017·3 cites·6 claims
- 0665US8037322B2Power consumption reduction device for data backupFUJITSU LTD·Filed 2008·Granted Oct 11, 2011·6 cites·5 claims
- 0758US11121060B2Electronics assemblies and cooling structures having metalized exterior surfaceTOYOTA ENG & MFG NORTH AMERICA·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 0858US10224265B2Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel systemTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Mar 5, 2019·0 cites·20 claims
- 0952US10032694B2Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel systemTOYOTA ENG & MFG NORTH AMERICA·Filed 2016·Granted Jul 24, 2018·0 cites·9 claims
- 1043US10192814B2Electronic assemblies having a cooling chip layer with fluid channels and through substrate viasTOYOTA ENG & MFG NORTH AMERICA·Filed 2017·Granted Jan 29, 2019·0 cites·20 claims
- 1134US2016211349A1Semiconductor device and a method for manufacturing a semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
- 1234US2016218190A1Semiconductor device and method for manufacturing semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →