Inventor · disambiguated record
Stephen R. Hooper
Also filed as: HOOPER STEPHEN R · HOOPER STEPHEN RYAN
64 granted patents·13 pending applications·474 citations·filing 2002–2025
98Inventor score
Top patents by PatentIndex Score
77 records- 0199US10053359B2Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 21, 2018·35 cites·18 claims
- 0298US9499397B2Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereofBOWLES PHILIP H·Filed 2014·Granted Nov 22, 2016·49 cites·20 claims
- 0396US9108841B1Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereofBOWLES PHILIP H·Filed 2014·Granted Aug 18, 2015·23 cites·20 claims
- 0496US7109055B2Methods and apparatus having wafer level chip scale package for sensing elementsFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 19, 2006·60 cites·20 claims
- 0595US8359927B2Molded differential PRT pressure sensorFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jan 29, 2013·41 cites·20 claims
- 0694US9165886B2Sensor packaging method and sensor packagesFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 20, 2015·15 cites·16 claims
- 0793US7900521B2Exposed pad backside pressure sensor packageFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Mar 8, 2011·28 cites·20 claims
- 0892US9790089B2MEMS sensor with side port and method of fabricating sameNXP USA INC·Filed 2017·Granted Oct 17, 2017·9 cites·20 claims
- 0992US9470652B1Sensing field effect transistor devices and method of their manufactureFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 18, 2016·9 cites·18 claims
- 1091US8659167B1Sensor packaging method and sensor packagesBOWLES PHILIP H·Filed 2012·Granted Feb 25, 2014·11 cites·20 claims
- 1190US9818656B1Devices and methods for testing integrated circuit devicesNXP USA INC·Filed 2017·Granted Nov 14, 2017·8 cites·20 claims
- 1290US8476087B2Methods for fabricating sensor device package using a sealing structureHOOPER STEPHEN R·Filed 2011·Granted Jul 2, 2013·14 cites·19 claims
- 1389US9446940B2Stress isolation for MEMS deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Sep 20, 2016·6 cites·10 claims
- 1488US11031681B2Package integrated waveguideNXP USA INC·Filed 2019·Granted Jun 8, 2021·6 cites·20 claims
- 1587US7834431B2Leadframe for packaged electronic device with enhanced mold locking capabilityFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Nov 16, 2010·15 cites·11 claims
- 1686US12012328B2Stress isolated device package and method of manufactureNXP USA INC·Filed 2021·Granted Jun 18, 2024·1 cites·16 claims
- 1785US8841758B2Semiconductor device package and method of manufactureDANIELS DWIGHT L·Filed 2012·Granted Sep 23, 2014·9 cites·19 claims
- 1884US8384168B2Sensor device with sealing structureFREESCALE SEMICONDUCTOR INC·Filed 2011·Granted Feb 26, 2013·8 cites·20 claims
- 1984US7632698B2Integrated circuit encapsulation and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Dec 15, 2009·16 cites·14 claims
- 2083US10340211B1Sensor module with blade insertNXP BV·Filed 2018·Granted Jul 2, 2019·5 cites·20 claims
- 2183US7316965B2Substrate contact for a capped MEMS and method of making the substrate contact at the wafer levelFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jan 8, 2008·13 cites·18 claims
- 2281US9018029B1Vent hole sealing in multiple die sensor deviceBOWLES PHILIP H·Filed 2013·Granted Apr 28, 2015·4 cites·20 claims
- 2381US8686550B2Method and apparatus for high pressure sensor deviceMCDONALD WILLIAM G·Filed 2012·Granted Apr 1, 2014·9 cites·8 claims
- 2480US8307714B1Dual port pressure sensorHOOPER STEPHEN R·Filed 2011·Granted Nov 13, 2012·7 cites·20 claims
- 2579US9638597B2Differential pressure sensor assemblyHOOPER STEPHEN R·Filed 2014·Granted May 2, 2017·6 cites·20 claims
- 2678US9663350B2Stress isolated differential pressure sensorFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 30, 2017·4 cites·20 claims
- 2778US9365414B2Sensor package having stacked dieBOWLES PHILIP H·Filed 2014·Granted Jun 14, 2016·4 cites·20 claims
- 2878US9090454B2Sequential wafer bondingBOWLES PHILIP H·Filed 2013·Granted Jul 28, 2015·2 cites·15 claims
- 2978US8906747B2Cavity-type semiconductor package and method of packaging sameHOOPER STEPHEN R·Filed 2012·Granted Dec 9, 2014·4 cites·11 claims
- 3077US9455216B2Semiconductor device package and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 27, 2016·2 cites·20 claims
- 3176US11760623B2No-gel pressure sensor packageNXP USA INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 3276US10790220B2Press-fit semiconductor deviceNXP BV·Filed 2018·Granted Sep 29, 2020·3 cites·20 claims
- 3376US9376310B2Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 28, 2016·2 cites·20 claims
- 3476US7014888B2Method and structure for fabricating sensors with a sacrificial gel domeFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Mar 21, 2006·25 cites·17 claims
- 3575US10658303B1High aspect ratio connection for EMI shieldingNXP USA INC·Filed 2018·Granted May 19, 2020·2 cites·20 claims
- 3674US9040355B2Sensor package and method of forming sameBOWLES PHILIP H·Filed 2012·Granted May 26, 2015·3 cites·15 claims
- 3772US11127645B2Grounding lids in integrated circuit devicesNXP USA INC·Filed 2019·Granted Sep 21, 2021·1 cites·20 claims
- 3872US9346671B2Shielding MEMS structures during wafer dicingFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 24, 2016·2 cites·16 claims
- 3971US9227838B2Cavity-type semiconductor package and method of packaging sameFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 5, 2016·2 cites·14 claims
- 4070US9927392B2Sensing field effect transistor devices, systems in which they are incorporated, and methods of their fabricationROOP RAYMOND M·Filed 2014·Granted Mar 27, 2018·2 cites·14 claims
- 4169US11335652B2Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguideNXP USA INC·Filed 2019·Granted May 17, 2022·1 cites·20 claims
- 4269US9598280B2Environmental sensor structureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 21, 2017·2 cites·20 claims
- 4367US12469773B2Semiconductor device with attached battery and method thereforNXP USA INC·Filed 2022·Granted Nov 11, 2025·0 cites·14 claims
- 4467US9285422B2Tester and method for testing a strip of devicesDAWSON CHAD S·Filed 2012·Granted Mar 15, 2016·1 cites·20 claims
- 4567US2025266335A1Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2025·Application pending·0 cites
- 4666US12406911B2Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2022·Granted Sep 2, 2025·0 cites·6 claims
- 4764US11498829B2No-gel pressure sensor packageNXP USA INC·Filed 2020·Granted Nov 15, 2022·0 cites·15 claims
- 4863US8890308B2Integrated circuit package and method of forming the sameHOOPER STEPHEN R·Filed 2012·Granted Nov 18, 2014·2 cites·20 claims
- 4962US9676611B2Sensor device packages and related fabrication methodsHOOPER STEPHEN R·Filed 2013·Granted Jun 13, 2017·1 cites·18 claims
- 5060US9021689B2Method of making a dual port pressure sensorHOOPER STEPHEN R·Filed 2011·Granted May 5, 2015·1 cites·20 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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