Inventor · disambiguated record
Fuhan Liu
Also filed as: LIU FUHAN
4 granted patents·4 pending applications·111 citations·filing 2006–2016
79Inventor score
Files withGEORGIA TECH RES INST4LIU FUHAN1MCGREGOR DAVID ROSS1SUNDARAM VENKATESH1SUNDARAM VENKATESH V1
Top patents by PatentIndex Score
8 records- 0193US8536695B2Chip-last embedded interconnect structuresLIU FUHAN·Filed 2012·Granted Sep 17, 2013·57 cites·26 claims
- 0292US9275934B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameSUNDARAM VENKATESH·Filed 2011·Granted Mar 1, 2016·43 cites·17 claims
- 0388US10672718B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameGEORGIA TECH RES INST·Filed 2016·Granted Jun 2, 2020·6 cites·18 claims
- 0471US8391017B2Thin-film capacitor structures embedded in semiconductor packages and methods of makingMCGREGOR DAVID ROSS·Filed 2010·Granted Mar 5, 2013·5 cites·16 claims
- 0538US2007047888A1Capped low loss polymer waveguide and method of making sameGEORGIA TECH RES INST·Filed 2006·Application pending·0 cites
- 0638US2010270646A1Thin-film capacitor structures embedded in semiconductor packages and methods of makingGEORGIA TECH RES INST·Filed 2010·Application pending·0 cites
- 0736US2012261805A1Through package via structures in panel-based silicon substrates and methods of making the sameSUNDARAM VENKATESH V·Filed 2012·Application pending·0 cites
- 0833US2016113108A1Package-level electromagnetic interference shielding structures for a substrateGEORGIA TECH RES INST·Filed 2015·Application pending·0 cites
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