Individual holder
SUNDARAM VENKATESH V
US·1 granted patent·1 pending application·24 citations·filing 2011–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
2 records- 0192US9167694B2Ultra-thin interposer assemblies with through viasSUNDARAM VENKATESH V·Filed 2011·Granted Oct 20, 2015·24 cites·26 claims
- 0236US2012261805A1Through package via structures in panel-based silicon substrates and methods of making the sameSUNDARAM VENKATESH V·Filed 2012·Application pending·0 cites
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