Inventor · disambiguated record
Venkatesh Sundaram
Also filed as: SUNDARAM VENKATESH · SUNDARAM VENKATESH V
21 granted patents·12 pending applications·487 citations·filing 2001–2024
96Inventor score
Files withGEORGIA TECH RES INST17NOVELIS INC3RAJ PULUGURTHA MARKONDEYA2SARAS MICRO DEVICES INC2SUNDARAM VENKATESH V2
Top patents by PatentIndex Score
33 records- 0197US7795995B2Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applicationsGEORGIA TECH RES INST·Filed 2005·Granted Sep 14, 2010·62 cites·33 claims
- 0296US8013688B2Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applicationsGEORGIA TECH RES INST·Filed 2010·Granted Sep 6, 2011·24 cites·22 claims
- 0396US7068124B2Integrated passive devices fabricated utilizing multi-layer, organic laminatesGEORGIA TECH RES INST·Filed 2005·Granted Jun 27, 2006·39 cites·32 claims
- 0494US6900708B2Integrated passive devices fabricated utilizing multi-layer, organic laminatesGEORGIA TECH RES INST·Filed 2003·Granted May 31, 2005·79 cites·34 claims
- 0593US8536695B2Chip-last embedded interconnect structuresLIU FUHAN·Filed 2012·Granted Sep 17, 2013·57 cites·26 claims
- 0692US9275934B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameSUNDARAM VENKATESH·Filed 2011·Granted Mar 1, 2016·43 cites·17 claims
- 0792US9167694B2Ultra-thin interposer assemblies with through viasSUNDARAM VENKATESH V·Filed 2011·Granted Oct 20, 2015·24 cites·26 claims
- 0892US8345433B2Heterogeneous organic laminate stack ups for high frequency applicationsAVX CORP·Filed 2005·Granted Jan 1, 2013·25 cites·8 claims
- 0990US6987307B2Stand-alone organic-based passive devicesGEORGIA TECH RES INST·Filed 2003·Granted Jan 17, 2006·58 cites·9 claims
- 1089US7260890B2Methods for fabricating three-dimensional all organic interconnect structuresGEORGIA TECH RES INST·Filed 2003·Granted Aug 28, 2007·35 cites·19 claims
- 1188US10672718B2Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameGEORGIA TECH RES INST·Filed 2016·Granted Jun 2, 2020·6 cites·18 claims
- 1288US9417415B2Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrateGEORGIA TECH RES INST·Filed 2014·Granted Aug 16, 2016·9 cites·9 claims
- 1385US7805834B2Method for fabricating three-dimensional all organic interconnect structuresGEORGIA TECH RES INST·Filed 2007·Granted Oct 5, 2010·10 cites·20 claims
- 1476US8970036B2Stress relieving second level interconnect structures and methods of making the sameRAJ PULUGURTHA MARKONDEYA·Filed 2011·Granted Mar 3, 2015·6 cites·7 claims
- 1574US12315787B2Embedded semiconductor packages and methods thereofGEORGIA TECH RES INST·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 1673US10615057B1Encapsulation process for semiconductor devicesNORTHROP GRUMMAN SYSTEMS CORP·Filed 2018·Granted Apr 7, 2020·2 cites·20 claims
- 1771US8391017B2Thin-film capacitor structures embedded in semiconductor packages and methods of makingMCGREGOR DAVID ROSS·Filed 2010·Granted Mar 5, 2013·5 cites·16 claims
- 1865US2020082972A1Continuous coils containing a thin anodized film layer and systems and methods for making the sameNOVELIS INC·Filed 2019·Application pending·0 cites
- 1961US2024282942A1Aluminum-based anode for lithium-ion batteriesNOVELIS INC·Filed 2022·Application pending·0 cites
- 2057US12027453B2Embedded semiconductor packages and methods thereofGEORGIA TECH RES INST·Filed 2020·Granted Jul 2, 2024·0 cites·31 claims
- 2156US9173282B2Interconnect structures and methods of making the sameRAJ PULUGURTHA MARKONDEYA·Filed 2011·Granted Oct 27, 2015·1 cites·11 claims
- 2256US8633601B2Interconnect assemblies and methods of making and using sameKUMBHAT NITESH·Filed 2010·Granted Jan 21, 2014·2 cites·19 claims
- 2353US2023107273A1Aluminum anode current collectors for lithium ion batteriesNOVELIS INC·Filed 2021·Application pending·0 cites
- 2442US2014347157A1Magnetic device utilizing nanocomposite films layered with adhesivesGEORGIA TECH RES INST·Filed 2012·Application pending·0 cites
- 2541US2024312729A1Infiltration and drying under pressure for conductive polymer coating on porous substratesSARAS MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 2639US12500040B2Planar high-density aluminum capacitors for stacking and embeddingSARAS MICRO DEVICES INC·Filed 2021·Granted Dec 16, 2025·0 cites·41 claims
- 2738US2014145328A1Interconnect assemblies and methods of making and using sameGEORGIA TECH RES INST·Filed 2014·Application pending·0 cites
- 2838US2010270646A1Thin-film capacitor structures embedded in semiconductor packages and methods of makingGEORGIA TECH RES INST·Filed 2010·Application pending·0 cites
- 2936US2012261805A1Through package via structures in panel-based silicon substrates and methods of making the sameSUNDARAM VENKATESH V·Filed 2012·Application pending·0 cites
- 3034US2016109653A1Optical interconnects and methods of fabricating sameGEORGIA TECH RES INST·Filed 2015·Application pending·0 cites
- 3134US2002158305A1Organic substrate having integrated passive componentsFiled 2001·Application pending·0 cites
- 3233US2016113108A1Package-level electromagnetic interference shielding structures for a substrateGEORGIA TECH RES INST·Filed 2015·Application pending·0 cites
- 3329US2016111380A1New structure of microelectronic packages with edge protection by coatingGEORGIA TECH RES INST·Filed 2015·Application pending·0 cites
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