Inventor · disambiguated record
Ichirou Ogura
Also filed as: OGURA ICHIROU
11 granted patents·4 pending applications·21 citations·filing 2006–2013
84Inventor score
Top patents by PatentIndex Score
15 records- 0190US8487052B2Resin composition for fiber-reinforced composite material, cured product thereof, fiber-reinforced composite material, molding of fiber-reinforced resin, and process for production thereofKOBAYASHI ATSUKO·Filed 2010·Granted Jul 16, 2013·7 cites·8 claims
- 0284US8883938B2Resin composition for fiber-reinforced composite material, cured product thereof, fiber-reinforced composite material, molding of fiber-reinforced resin, and process for production thereofKOBAYASHI ATSUKO·Filed 2010·Granted Nov 11, 2014·4 cites·15 claims
- 0369US8168731B2Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the sameSATOU YUTAKA·Filed 2009·Granted May 1, 2012·4 cites·18 claims
- 0466US8288003B2Method for producing phosphorus-containing phenolic compound, novel phosphorus-containing phenol, curable resin composition, cured product of the same, printed wiring board, and semiconductor sealing materialHAYASHI KOJI·Filed 2009·Granted Oct 16, 2012·3 cites·15 claims
- 0565US8084567B2Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resinOGURA ICHIROU·Filed 2009·Granted Dec 27, 2011·3 cites·3 claims
- 0661US2013281576A1Resin composition for fiber-reinforced composite material, cured product thereof, fiber-reinforced composite material, molding of fiber-reinforced resin, and process for production thereofDAINIPPON INK & CHEMICALS·Filed 2013·Application pending·0 cites
- 0751US8440781B2Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resinOGURA ICHIROU·Filed 2009·Granted May 14, 2013·0 cites·8 claims
- 0848US7718741B2Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resinDAINIPPON INK & CHEMICALS·Filed 2006·Granted May 18, 2010·0 cites·12 claims
- 0948US2009088535A1Method of producing phenol resin and method of producing epoxy resinDAINIPPON INK & CHEMICALS·Filed 2006·Application pending·0 cites
- 1047US8729192B2Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating materialARITA KAZUO·Filed 2006·Granted May 20, 2014·0 cites·15 claims
- 1145US8420749B2Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resinOGURA ICHIROU·Filed 2006·Granted Apr 16, 2013·0 cites·9 claims
- 1245US8394911B2Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit boardSATOU YUTAKA·Filed 2011·Granted Mar 12, 2013·0 cites·16 claims
- 1341US8703845B2Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing materialOGURA ICHIROU·Filed 2011·Granted Apr 22, 2014·0 cites·16 claims
- 1440US2009052909A1Optical communication module and optical signal transmission methodNEC CORP·Filed 2006·Application pending·0 cites
- 1532US2013184377A1Curable resin composition, cured product thereof, phenol resin, epoxy resin, and semiconductor encapsulating materialOGURA ICHIROU·Filed 2011·Application pending·0 cites
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