Inventor · disambiguated record
Ben Mooring
Also filed as: MOORING BEN
8 granted patents·897 citations·filing 1996–2012
89Inventor score
Top patents by PatentIndex Score
8 records- 0195US6428394B1Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feedLAM RES CORP·Filed 2000·Granted Aug 6, 2002·65 cites·19 claims
- 0294US6312525B1Modular architecture for semiconductor wafer fabrication equipmentAPPLIED MATERIALS INC·Filed 1998·Granted Nov 6, 2001·693 cites·18 claims
- 0391US7486878B2Offset correction methods and arrangement for positioning and inspecting substratesLAM RES CORP·Filed 2006·Granted Feb 3, 2009·25 cites·30 claims
- 0491US5789878ADual plane robotAPPLIED MATERIALS INC·Filed 1996·Granted Aug 4, 1998·77 cites·45 claims
- 0590US7479236B2Offset correction techniques for positioning substratesLAM RES CORP·Filed 2006·Granted Jan 20, 2009·20 cites·22 claims
- 0684US8135485B2Offset correction techniques for positioning substrates within a processing chamberCHEN JACK·Filed 2008·Granted Mar 13, 2012·10 cites·19 claims
- 0760US8328942B2Wafer heating and temperature control by backside fluid injectionMOORING BEN·Filed 2004·Granted Dec 11, 2012·7 cites·23 claims
- 0849US8591665B2Wafer heating and temperature control by backside fluid injectionMOORING BEN·Filed 2012·Granted Nov 26, 2013·0 cites·17 claims
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