Inventor · disambiguated record
Yoshizumi Sato
Also filed as: SATO YOSHIZUMI
11 granted patents·1 pending application·474 citations·filing 1992–2006
92Inventor score
Top patents by PatentIndex Score
12 records- 0196US5865934AMethod of manufacturing printed wiring boardsTOSHIBA KK·Filed 1997·Granted Feb 2, 1999·121 cites·26 claims
- 0295US6329610B1Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring boardTOSHIBA KK·Filed 1998·Granted Dec 11, 2001·225 cites·37 claims
- 0392US5736681APrinted wiring board having an interconnection penetrating an insulating layerTOSHIBA KK·Filed 1994·Granted Apr 7, 1998·77 cites·22 claims
- 0470US7134193B2Method for manufacturing a wiring boardDAINIPPON PRINTING CO LTD·Filed 2004·Granted Nov 14, 2006·10 cites·1 claims
- 0563US7526859B2Apparatus for manufacturing a wiring boardDAINIPPON PRINTING CO LTD·Filed 2006·Granted May 5, 2009·0 cites·2 claims
- 0653US6865801B2Apparatus for manufacturing a wiring boardTOSHIBA KK·Filed 2001·Granted Mar 15, 2005·3 cites·16 claims
- 0749US5407557AWiring boards and manufacturing methods thereofTOSHIBA KK·Filed 1994·Granted Apr 18, 1995·15 cites·15 claims
- 0843US6534873B1Semiconductor package and printed wiring board for semiconductor packageTOSHIBA KK·Filed 2000·Granted Mar 18, 2003·1 cites·9 claims
- 0942US5310966AWiring boards and manufacturing methods thereofTOSHIBA KK·Filed 1993·Granted May 10, 1994·10 cites·10 claims
- 1038US5333379AMethod of producing a three-dimensional wiring boardTOSHIBA KK·Filed 1992·Granted Aug 2, 1994·8 cites·8 claims
- 1137US2002046880A1Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring boardTOSHIBA KK·Filed 2001·Application pending·0 cites
- 1235US6507995B1Apparatus for manufacturing a wiring substrateTOSHIBA KK·Filed 1998·Granted Jan 21, 2003·4 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →