Inventor · disambiguated record
Christopher James Kapusta
Also filed as: GORCZYCA THOMAS BERT · KAPUSTA CHRISTOPHER · KAPUSTA CHRISTOPHER J · KAPUSTA CHRISTOPHER JAMES
81 granted patents·16 pending applications·554 citations·filing 2001–2024
99Inventor score
Files withGEN ELECTRIC71KAPUSTA CHRISTOPHER JAMES8LOCKHEED CORP7GE AVIATION SYSTEMS LLC3AMPHENOL THERMOMETRICS INC2
Top patents by PatentIndex Score
97 records- 0197US10163773B1Electronics package having a self-aligning interconnect assembly and method of making sameGEN ELECTRIC·Filed 2017·Granted Dec 25, 2018·16 cites·19 claims
- 0297US9570783B1Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the sameGEN ELECTRIC·Filed 2015·Granted Feb 14, 2017·13 cites·22 claims
- 0396US7315161B2Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense componentsGEN ELECTRIC·Filed 2005·Granted Jan 1, 2008·25 cites·14 claims
- 0495US10196745B2Lid and method for sealing a non-magnetic packageGEN ELECTRIC·Filed 2014·Granted Feb 5, 2019·8 cites·29 claims
- 0595US8276268B2System and method of forming a patterned conformal structureKAPUSTA CHRISTOPHER JAMES·Filed 2008·Granted Oct 2, 2012·38 cites·17 claims
- 0695US7752751B2System and method of forming a low profile conformal shieldGEN ELECTRIC·Filed 2008·Granted Jul 13, 2010·47 cites·18 claims
- 0794US10333493B2Embedded RF filter package structure and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Jun 25, 2019·13 cites·19 claims
- 0892US8742646B2Ultrasound acoustic assemblies and methods of manufactureWODNICKI ROBERT GIDEON·Filed 2012·Granted Jun 3, 2014·16 cites·6 claims
- 0992US7570133B1Wideband passive amplitude compensated time delay moduleLOCKHEED CORP·Filed 2006·Granted Aug 4, 2009·21 cites·19 claims
- 1090US11630086B2Sensor system and methodGEN ELECTRIC·Filed 2021·Granted Apr 18, 2023·1 cites·20 claims
- 1190US8026608B2Stackable electronic packageGEN ELECTRIC·Filed 2009·Granted Sep 27, 2011·13 cites·9 claims
- 1289US8115117B2System and method of forming isolated conformal shielding areasKAPUSTA CHRISTOPHER JAMES·Filed 2009·Granted Feb 14, 2012·19 cites·25 claims
- 1388US10208382B2Method for making a seam-sealable non-magnetic lid and packageGEN ELECTRIC·Filed 2017·Granted Feb 19, 2019·2 cites·23 claims
- 1487US7952196B1Affordable high performance high frequency multichip module fabrication and apparatusLOCKHEED CORP·Filed 2008·Granted May 31, 2011·14 cites·13 claims
- 1586US8163596B2Stackable electronic package and method of making sameKAPUSTA CHRISTOPHER JAMES·Filed 2009·Granted Apr 24, 2012·12 cites·17 claims
- 1685US11982645B2Sensor system and methodGEN ELECTRIC·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 1785US10605785B2Sensor system and methodGEN ELECTRIC·Filed 2017·Granted Mar 31, 2020·2 cites·18 claims
- 1885US9954263B2Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the sameGEN ELECTRIC·Filed 2015·Granted Apr 24, 2018·4 cites·20 claims
- 1985US8536700B2Stackable electronic package and method of fabricating sameSABATINI JAMES·Filed 2011·Granted Sep 17, 2013·6 cites·6 claims
- 2084US11950394B2Liquid-cooled assembly and methodGE AVIATION SYSTEMS LLC·Filed 2021·Granted Apr 2, 2024·1 cites·16 claims
- 2184US7633667B2Apparatus and method of forming high performance integrated RF optical moduleGEN ELECTRIC·Filed 2007·Granted Dec 15, 2009·7 cites·23 claims
- 2284US6767764B2Microelectromechanical system device packaging methodGEN ELECTRIC·Filed 2002·Granted Jul 27, 2004·32 cites·8 claims
- 2382US11079359B2Sensor system and methodGEN ELECTRIC·Filed 2019·Granted Aug 3, 2021·1 cites·21 claims
- 2482US7605466B2Sealed wafer packaging of microelectromechanical systemsGEN ELECTRIC·Filed 2007·Granted Oct 20, 2009·10 cites·17 claims
- 2582US7427566B2Method of making an electronic device cooling systemGEN ELECTRIC·Filed 2005·Granted Sep 23, 2008·12 cites·24 claims
- 2682US6988706B2Piezoelectric microvalveGEN ELECTRIC·Filed 2003·Granted Jan 24, 2006·24 cites·18 claims
- 2781US10804115B2Electronics package with integrated interconnect structure and method of manufacturing thereofGEN ELECTRIC·Filed 2017·Granted Oct 13, 2020·3 cites·24 claims
- 2880US7901970B2Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense componentsGEN ELECTRIC·Filed 2007·Granted Mar 8, 2011·7 cites·6 claims
- 2980US7727808B2Ultra thin die electronic packageGEN ELECTRIC·Filed 2008·Granted Jun 1, 2010·6 cites·12 claims
- 3079US10804174B2Non-magnetic package and method of manufactureGEN ELECTRIC·Filed 2018·Granted Oct 13, 2020·2 cites·17 claims
- 3179US10432168B2Systems and methods for quartz wafer bondingGEN ELECTRIC·Filed 2015·Granted Oct 1, 2019·3 cites·26 claims
- 3279US9806390B2Radio frequency die package with inverted ground plane and method of making sameGEN ELECTRIC·Filed 2017·Granted Oct 31, 2017·2 cites·20 claims
- 3379US7316512B2Interconnect deviceGEN ELECTRIC·Filed 2004·Granted Jan 8, 2008·19 cites·46 claims
- 3478US10431509B2Non-magnetic package and method of manufactureGEN ELECTRIC·Filed 2014·Granted Oct 1, 2019·3 cites·7 claims
- 3577US6602739B1Method for making multichip module substrates by encapsulating electrical conductors and filling gapsLOCKHEED CORP·Filed 2002·Granted Aug 5, 2003·25 cites·6 claims
- 3676US7112951B2MEMS based current sensor using magnetic-to-mechanical conversion and reference componentsGEN ELECTRIC·Filed 2004·Granted Sep 26, 2006·12 cites·36 claims
- 3775US7993064B2Photonic power devices and methods of manufacturing the sameGEN ELECTRIC·Filed 2008·Granted Aug 9, 2011·1 cites·15 claims
- 3875US6935792B2Optoelectronic package and fabrication methodGEN ELECTRIC·Filed 2002·Granted Aug 30, 2005·21 cites·66 claims
- 3974USRE47651EStackable electronic package and method of fabricating sameGEN ELECTRIC·Filed 2017·Granted Oct 15, 2019·1 cites·27 claims
- 4074US10332832B2Method of manufacturing an electronics package using device-last or device-almost last placementGEN ELECTRIC·Filed 2017·Granted Jun 25, 2019·2 cites·21 claims
- 4173US10804116B2Electronics package with integrated interconnect structure and method of manufacturing thereofGEN ELECTRIC·Filed 2019·Granted Oct 13, 2020·1 cites·20 claims
- 4273US7221144B2Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivitiesGEN ELECTRIC·Filed 2005·Granted May 22, 2007·6 cites·32 claims
- 4372US6773962B2Microelectromechanical system device packaging methodGEN ELECTRIC·Filed 2001·Granted Aug 10, 2004·15 cites·7 claims
- 4471US6994897B2Method of processing high-resolution flex circuits with low distortionGEN ELECTRIC·Filed 2002·Granted Feb 7, 2006·16 cites·12 claims
- 4570US10784576B2True time delay beam former module and method of making the sameGEN ELECTRIC·Filed 2017·Granted Sep 22, 2020·1 cites·25 claims
- 4669US9299661B2Integrated circuit package and method of making sameKAPUSTA CHRISTOPHER JAMES·Filed 2009·Granted Mar 29, 2016·4 cites·32 claims
- 4768US10892237B2Methods of fabricating high voltage semiconductor devices having improved electric field suppressionGEN ELECTRIC·Filed 2018·Granted Jan 12, 2021·1 cites·13 claims
- 4868US10770382B2Low inductance stackable solid-state switching module and method of manufacturing thereofGEN ELECTRIC·Filed 2018·Granted Sep 8, 2020·1 cites·27 claims
- 4968US8748754B2System and method of forming a patterned conformal structureKAPUSTA CHRISTOPHER JAMES·Filed 2011·Granted Jun 10, 2014·2 cites·17 claims
- 5066US11538769B2High voltage semiconductor devices having improved electric field suppressionGEN ELECTRIC·Filed 2018·Granted Dec 27, 2022·1 cites·18 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →